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用于电化学检测铜(Ⅱ)离子的镍基复合线材的制备。

Fabrication of the Ni-based composite wires for electrochemical detection of copper(Ⅱ) ions.

机构信息

Department of Materials Science and Engineering, Ocean University of China, 266100, Qingdao, PR China.

Department of Materials Science and Engineering, Ocean University of China, 266100, Qingdao, PR China.

出版信息

Anal Chim Acta. 2021 Jan 25;1143:45-52. doi: 10.1016/j.aca.2020.11.028. Epub 2020 Nov 24.

Abstract

Copper ions (Cu) pollution in the water environment poses a great threat to the health function of life-sustaining metabolic activities. However, the current detection methods need relatively expensive instruments, complex operation procedures and long time, so a facile and direct detection method is desired to be developed. In this work, the Ni-based composite wires with p-n junction (the Ni/NiO/ZnO/Chitosan wire) and Schottky junction (the Ni/NiO/Au/Chitosan wire) were fabricated, and the barrier driven electrochemical sensing mechanism was studied. The direct and facile detection of Cu was achieved with a wide linear range (0-6000 nM) and a low LOD (0.81 nM). The excellent stability and recovery in real water samples made the Ni-based composite wires a promising candidate for the practical application. The interfacial barriers of semiconductor can be used as a special sensing factor to develop novel sensors.

摘要

水环境中的铜离子(Cu)污染对维持生命的新陈代谢活动的健康功能构成了极大威胁。然而,目前的检测方法需要相对昂贵的仪器、复杂的操作程序和较长的时间,因此需要开发一种简便直接的检测方法。在这项工作中,制备了具有 p-n 结(Ni/NiO/ZnO/壳聚糖线)和肖特基结(Ni/NiO/Au/壳聚糖线)的 Ni 基复合线,并研究了其势垒驱动电化学传感机制。通过该机制实现了对 Cu 的直接、简便检测,具有较宽的线性范围(0-6000 nM)和较低的检出限(0.81 nM)。在实际水样中的出色稳定性和回收率使 Ni 基复合线成为实际应用的有前途的候选者。半导体的界面势垒可以用作开发新型传感器的特殊传感因子。

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