Li Qi, Bai Ruijie, Gao Yang, Wu Rongyao, Ju Kuan, Tan Jianping, Xuan Fuzhen
School of Mechanical and Power Engineering, East China University of Science and Technology, Shanghai 200237, China.
ACS Appl Mater Interfaces. 2021 Mar 3;13(8):10171-10180. doi: 10.1021/acsami.0c21168. Epub 2021 Feb 16.
Multifunctional sensing devices with high flexibility, high sensitivity, and scalable fabrication are inevitable components of Internet of Things (IoT) for human-machine interfaces, structural health monitoring, and soft robots. Herein, high-performance flexible sensor arrays using carboxymethylcellulose (CMC) and its composite were developed for mechanical and thermal stimuli detection by laser direct writing. CMC contains abundant carbon precursors for strain-sensitive laser-carbonized CMC (LC-CMC), while the incorporation of graphene oxide (GO) into CMC leads to the formation of thermal-sensitive laser-carbonized GO/CMC (LC-GO/CMC). The LC-CMC-based strain sensor delivers gauge factors of 487.7 (strain < 8.5%) and 8557 (8.5% < strain < 14%), with long-term stability over 10 000 cycles. With 0.2 wt % GO, the LC-GO/CMC-based device provides a temperature coefficient of resistance of -0.289% °C , higher than the Cr-based commercial sensor. The potential application of the devices in IoT is proved by combining the near-field communication technology with the LC-CMC-based device to monitor the strain suffered by 316L stainless steel during the fatigue test. Moreover, an integrated device based on the strain and temperature sensing arrays accomplishes the simultaneous measurement of temperature and mechanical deformation in real time.
具有高柔韧性、高灵敏度和可扩展制造的多功能传感设备是用于人机接口、结构健康监测和软体机器人的物联网(IoT)的必备组件。在此,通过激光直写技术开发了使用羧甲基纤维素(CMC)及其复合材料的高性能柔性传感器阵列,用于机械和热刺激检测。CMC含有丰富的碳前驱体,可用于制备应变敏感的激光碳化CMC(LC-CMC),而将氧化石墨烯(GO)掺入CMC会导致形成热敏的激光碳化GO/CMC(LC-GO/CMC)。基于LC-CMC的应变传感器的应变系数分别为487.7(应变<8.5%)和8557(8.5%<应变<14%),具有超过10000次循环的长期稳定性。含有0.2 wt% GO的基于LC-GO/CMC的器件的电阻温度系数为-0.289% °C,高于基于Cr的商用传感器。通过将近场通信技术与基于LC-CMC的器件相结合,以监测316L不锈钢在疲劳试验过程中所承受的应变,证明了这些器件在物联网中的潜在应用。此外,基于应变和温度传感阵列的集成器件可实时完成温度和机械变形的同步测量。