Zhang Jian, Wang Weizhen, Wang Nan, Wang Mingguang, Qi Yang
Department of Materials Physics and Chemistry, School of Materials Science and Engineering and State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang, Liaoning 110819, People's Republic of China.
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Science, Shenyang, Liaoning 110016, People's Republic of China.
J Colloid Interface Sci. 2021 Jun 15;592:291-295. doi: 10.1016/j.jcis.2021.02.063. Epub 2021 Feb 24.
Due to the crucial influence of interface structure and strain on the performance of heterojunctions, they have received extensive attention in recent years. In this article, the interface structure and strain of the BiSrCuO(Bi-2201)/MgO superconducting heterojunction prepared by molecular beam epitaxy were investigated by aberration-corrected high-angle annular dark-field scanning transmission electron microscopy (HAADF-STEM), energy-dispersive X-ray spectroscopy (EDX), and geometric phase analysis (GPA). The interfacial atomic sequence is determined as MgO-(CuO-CuO-Cu/BiO)-(Bi-2201), where a 0.53 nm thick CuO interlayer accompanied by Bi/Cu atomic co-occupation is observed between the Bi-2201 film and the MgO substrate. In addition, there is a typical coherent lattice-matching epitaxial interface between CuO/MgO with no defects and a semi-coherent domain-matching epitaxial interface between Bi-2201/CuO accompanied by an ideal misfit dislocation network. Because misfit dislocations almost compensate for the strain caused by lattice mismatch, the final Bi-2201 film undergoes in-plane compressive strain (ε ~ -0.573%) rather than expected tensile strain relative to bulk Bi-2201, which is attributed to the thermal expansion mismatch. The compressive strain gradually releases as the distance from the heterointerface increases.
由于界面结构和应变对异质结性能具有至关重要的影响,近年来它们受到了广泛关注。在本文中,利用像差校正高角度环形暗场扫描透射电子显微镜(HAADF-STEM)、能量色散X射线光谱(EDX)和几何相位分析(GPA),对通过分子束外延制备的BiSrCuO(Bi-2201)/MgO超导异质结的界面结构和应变进行了研究。确定界面原子序列为MgO-(CuO-CuO-Cu/BiO)-(Bi-2201),其中在Bi-2201薄膜与MgO衬底之间观察到一个0.53 nm厚的伴有Bi/Cu原子共占据的CuO中间层。此外,在无缺陷的CuO/MgO之间存在典型的相干晶格匹配外延界面,在Bi-2201/CuO之间存在伴有理想失配位错网络的半相干畴匹配外延界面。由于失配位错几乎补偿了晶格失配引起的应变,最终的Bi-2201薄膜相对于块状Bi-2201经历面内压缩应变(ε ~ -0.573%)而非预期的拉伸应变,这归因于热膨胀失配。随着与异质界面距离的增加,压缩应变逐渐释放。