Ye Z H, Baker A J M, Wong M H, Willis A J
Department of Animal and Plant Sciences, University of Sheffield, Sheffield, S. Yorks, S10 2TN, UK.
Department of Biology, Hong Kong Baptist University, 224 Waterloo Rd, Kowloon Tong, Hong Kong.
New Phytol. 1997 Jul;136(3):481-488. doi: 10.1046/j.1469-8137.1997.00758.x.
The effects of iron plaque on the growth of Typha latifolia L. and accumulation of copper and nickel in T. latifolia were investigated under laboratory conditions in nutrient solution cultures. Seedlings with and without iron plaque on their roots were exposed to 0.05 μg ml Cu and 0.10 μg ml Ni solutions for 72 d. The results showed no differences in root and shoot d. wt and leaf elongation when Cu or Ni were added to the solution and in the presence or absence of plaque. However, root length was reduced by Cu and Ni, and the reduction in root length was greater in the presence of plaque. Some Cu and Ni was adsorbed on root surfaces; roots with plaque took up more Cu, but less Ni than those without. The presence of plaque did not alter Cu uptake and translocation but increased Ni uptake and translocation. Most of the Cu and Ni taken up was retained in the roots, suggesting that the root tissue rather than the root surface or plaque is the main barrier for Cu and Ni transport. The results differ from those reported for other species.
在实验室水培条件下，研究了铁膜对宽叶香蒲生长以及宽叶香蒲中铜和镍积累的影响。将根系有和没有铁膜的幼苗暴露于含0.05μg/ml铜和0.10μg/ml镍的溶液中72天。结果表明，添加铜或镍时，无论有无铁膜，根和地上部鲜重以及叶片伸长均无差异。然而，铜和镍使根长缩短，且有铁膜时根长缩短幅度更大。一些铜和镍吸附在根表面；有铁膜的根比没有铁膜的根吸收更多的铜，但吸收的镍更少。铁膜的存在没有改变铜的吸收和转运，但增加了镍的吸收和转运。吸收的大部分铜和镍保留在根中，这表明根组织而非根表面或铁膜是铜和镍运输的主要屏障。这些结果与其他物种的报道不同。
