Thimot Jordan, Kim Kukjoo, Shi Chen, Shepard Kenneth L
Bioelectronic Systems Lab, Department of Electrical Engineering, Columbia University, New York NY.
Proc Cust Integr Circuits Conf. 2020 Mar;2020. doi: 10.1109/CICC48029.2020.9075888. Epub 2020 Apr 23.
This paper describes an inductively powered 27-Mbps, 0.08-mm CMOS transceiver with integrated RF receiver coils for simultaneous two-way, near-field data telemetry and power transmission for implantable systems. A four-coil inductive link operates at a 27-MHz carrier for power and a 700-MHz carrier for data telemetry with the antennae taking an area of only 2 mm by 2 mm. Amplitude-shift-keying (ASK) modulation is used for data downlink at 6.6 kbps and load-shift keying (LSK) backscattering is used for data uplink at 27 Mbps. The transceiver consumes 2.7 mW and can power a load consuming up to an additional 1.5 mW. Implemented in a 0.18-um silicon-on-insulator (SOI) technology, post-processing steps are used to decrease chip thickness to approximately 15um, making the chip flexible with a tissue-like form factor and removing the effects of the substrate on coil performance. Power harvesting circuitry, including passive rectifier, voltage regulator, RF limiter, ASK and LSK modulator, clock generator, and digital controller are positioned adjacent to the coils and limited to an area of 0.5 mm by 2mm. Complete transceiver functionality of the system has been achieved with overall power transfer efficiency (PTE) of 1.04% through 1 mm of tissue phantom between reader and implant.
本文介绍了一种采用电感供电的27Mbps、0.08mm CMOS收发器,其集成了射频接收线圈,用于植入式系统的同时双向近场数据遥测和电力传输。一种四线圈电感链路在27MHz载波上用于供电,在700MHz载波上用于数据遥测,天线占用面积仅为2mm×2mm。幅度键控(ASK)调制用于6.6kbps的数据下行链路,负载移相键控(LSK)反向散射用于27Mbps的数据上行链路。该收发器功耗为2.7mW,可为额外功耗高达1.5mW的负载供电。采用0.18μm绝缘体上硅(SOI)技术实现,后处理步骤用于将芯片厚度减小到约15μm,使芯片具有类似组织的外形且具有灵活性,并消除衬底对线圈性能的影响。功率收集电路,包括无源整流器、稳压器、射频限制器、ASK和LSK调制器、时钟发生器以及数字控制器,位于线圈附近,面积限制在0.5mm×2mm。通过读取器和植入物之间1mm厚的组织模型,系统实现了完整的收发器功能,总功率传输效率(PTE)为1.04%。