High-Performance Waveguide-Integrated BiOSe Photodetector for Si Photonic Integrated Circuits.

Due to the excellent electrical and optical properties and their integration capability without lattice matching requirements, low-dimensional materials have received increasing attention in silicon photonic circuits. BiOSe with high carrier mobility, narrow bandgap, and good air stability is very promising for high-performance near-infrared photodetectors. Here, the chemical vapor deposition method is applied to grow BiOSe onto mica, and our developed polycarbonate/polydimethylsiloxane-assisted transfer method enables the clean and intact transfer of BiOSe on top of a silicon waveguide. We demonstrated the BiOSe/Si waveguide integrated photodetector with a small dark current of 72.9 nA, high responsivity of 3.5 A·W, fast rise/decay times of 22/78 ns, and low noise-equivalent power of 15.1 pW·Hz at an applied voltage of 2 V in the O-band for transverse electric modes. Additionally, a microring resonator is designed for enhancing light-matter interaction, resulting in a wavelength-sensitive photodetector with reduced dark current (15.3 nA at 2 V) and more than a 3-fold enhancement in responsivity at the resonance wavelength, which is suitable for spectrally resolved applications. These results promote the integration of BiOSe with a silicon photonic platform and are expected to accelerate the future use of integrated photodetectors in spectroscopy, sensing, and communication applications.