Guziewicz Wojciech, Białas Anna, Napruszewska Bogna D, Zimowska Małgorzata, Gurgul Jacek
Faculty of Energy and Fuels, AGH University of Science and Technology, Mickiewicza 30, 30059 Kraków, Poland.
Jerzy Haber Institute of Catalysis and Surface Chemistry, Polish Academy of Sciences, Niezapominajek 8, 30239 Kraków, Poland.
Materials (Basel). 2021 Oct 13;14(20):6021. doi: 10.3390/ma14206021.
Aluminum doped titania samples were synthesized as supports of copper oxide catalysts for NO reduction with ammonia. Samples were prepared by the sol-gel method with various ratios of aluminum to titanium. Their thermal stability was examined by TG/DSC methods which revealed that precursors were decomposed at 450 °C. The XRD measurements showed that aluminum caused the diminishing of titania crystallites and was built into the anatase structure or formed an amorphous phase. The admixture of aluminum in titania resulted in a significant increase in specific surface area of mesoporous supports as determined by low temperature sorption of nitrogen. Results of the catalytic tests over copper/aluminum-titania samples obtained by impregnation pointed out that the addition of aluminum broadened the temperature window of high catalytic activity. The increase in Al concentration shifted the temperature of maximum activity to higher values, and at the same time lowered nitrous oxide formation as well. Better catalytic efficiency could result from high copper dispersion on the catalysts surface, as well as the synergistic interaction between Ti and Cu causing reduction in CuO species as confirmed by XPS measurements. It was shown that copper was present as Cu species mainly, forming Cu-O-Ti bonds on the catalysts surface.
合成了掺铝二氧化钛样品,用作氨还原一氧化氮的氧化铜催化剂载体。采用溶胶 - 凝胶法,以不同的铝钛比例制备样品。通过TG/DSC方法考察了它们的热稳定性,结果表明前驱体在450℃分解。XRD测量表明,铝导致二氧化钛微晶尺寸减小,并进入锐钛矿结构或形成非晶相。通过低温氮吸附测定,二氧化钛中铝的掺入导致介孔载体比表面积显著增加。通过浸渍法制备的铜/铝 - 二氧化钛样品的催化测试结果表明,铝的加入拓宽了高催化活性的温度窗口。铝浓度的增加将最大活性温度移向更高值,同时也降低了一氧化二氮的生成。催化剂表面铜的高分散性以及XPS测量证实的Ti和Cu之间的协同相互作用导致CuO物种的还原,可能产生更好的催化效率。结果表明,铜主要以Cu物种形式存在,在催化剂表面形成Cu - O - Ti键。