Yan Xudong, Sun Jianlin
School of Materials Science and Engineering, Beihang University, No. 37 Xueyuan Road, Beijing 100191, China.
School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China.
Materials (Basel). 2021 Dec 20;14(24):7911. doi: 10.3390/ma14247911.
Copper strips experience severe corrosion when rolled with an oil-in-water (O/W) emulsions lubricant. The effects of rolling reduction on the pitting corrosion behavior and surface microstructure of Cu strips were studied in detail using electrochemical measurements and electron back scattered diffraction (EBSD) analysis. It was found that the corrosion current densities of the rolled Cu strips increased with accumulated reduction, which also lowered the pitting potentials and weakened their corrosion resistances. Therefore, the corrosive tendency of Cu strips under different rolling reductions (ε) followed the order of ε < ε < ε < ε. The Cu surface easily reacted with chlorine, sulfur, and carbon components from O/W emulsions to generate pitting corrosion. Under the interactive effect of pitting corrosion and stress corrosion, pits expanded along the rolling direction. The aggregation of anions in surface defects, such as dislocations, metastable pits, and microcracks, further accelerated the pitting corrosion of the surface.
当铜带在水包油(O/W)乳液润滑剂中轧制时,会经历严重腐蚀。利用电化学测量和电子背散射衍射(EBSD)分析,详细研究了压下率对铜带点蚀行为和表面微观结构的影响。结果发现,轧制铜带的腐蚀电流密度随累积压下率的增加而增大,这也降低了点蚀电位并削弱了它们的耐腐蚀性。因此,不同压下率(ε)下铜带的腐蚀倾向遵循ε<ε<ε<ε的顺序。铜表面很容易与水包油乳液中的氯、硫和碳成分发生反应,从而产生点蚀。在点蚀和应力腐蚀的交互作用下,蚀坑沿轧制方向扩展。表面缺陷(如位错、亚稳态蚀坑和微裂纹)中阴离子的聚集进一步加速了表面的点蚀。