Preparation and characterization of a soy protein based bio-adhesive crosslinked by waterborne epoxy resin and polyacrylamide.

A simple and useful approach by using non-toxic and water-soluble raw material to improve the bonding properties of soy protein adhesive has attracted much attention recently. The objective of this research was to provide a simple and environmentally friendly approach for preparing a high adhesion performance soy protein adhesive in aqueous solution by using waterborne-epoxy resin, soy protein and water-soluble polyacrylamide (PAM). The chemical structure and curing characteristics, as well as the initial viscosity and adhesion performance of the resulted soy protein adhesive were characterized by H nuclear magnetic resonance (H-NMR), differential scanning calorimetry (DSC), a rotary viscosity meter and a plywood panel test. The H-NMR analysis results confirmed that epoxy resin was successfully crosslinked with the -NH groups of the soy protein molecule to form a water-resistance network structure, and the resulting adhesive contains active epoxy groups. It was found that the addition of PAM can decrease the apparent viscosity, lower curing temperature, and enhancing the wet shear strength of soy protein adhesives effectively, which were capable of facilitating their application as wood adhesives. The resulting soy protein adhesive containing 4% epoxy resin and 0.05% PAM dosage had a reasonable viscosity and lower cure temperature, and showed good water resistance and wet shear strength, which met the requirement for interior use plywood of the Chinese Industrial Standard. These results suggested that waterborne-epoxy resin can be used to prepare high-performance environmentally friendly soy protein adhesives, which might provide a feasible methodology to prepare bio-adhesive adhesives for plywood industrial applications.