Institute for Chemical and Bioengineering, ETH Zurich, Vladimir-Prelog-Weg 1, 8093 Zurich, Switzerland.
Microsoft Research, One Microsoft Way, Redmond, Washington 98052, United States.
Langmuir. 2022 Sep 20;38(37):11191-11198. doi: 10.1021/acs.langmuir.2c01167. Epub 2022 Sep 9.
A core-shell strategy was developed to protect synthetic DNA in organosilica particles encompassing dithiol linkages allowing for a DNA loading of 1.1 wt %. DNA stability tests involving bleach as an oxidant showed that following the procedure DNA was sandwiched between core particles of ca. 450 nm size and a protective outer layer, separating the DNA from the environment. Rapid aging tests at 60 °C and 50% relative humidity revealed that the DNA protected within this material was significantly more stable than nonprotected DNA, with an expected ambient temperature half-life of over 60 years. Still, and due to the presence of the dithiol linkages in the backbone of the organosilica material, the particles degraded in the presence of reducing agents (TCEP and glutathione) and disintegrated within several days in a simulated compost environment, which was employed to test the biodegradability of the material. This is in contrast to DNA encapsulated following state of the art procedures in pure SiO particles, which do not biodegrade in the investigated timeframes and conditions. The results show that synthetic DNA protected within dithiol comprising organosilica particles presents a strategy to store digital data at a high storage capacity for long time frames in a fully biodegradable format.
采用核壳策略来保护包含二硫键连接体的有机硅颗粒中的合成 DNA,允许 DNA 负载量为 1.1wt%。涉及漂白剂作为氧化剂的 DNA 稳定性测试表明,在该过程之后,DNA 被夹在约 450nm 大小的核心颗粒之间和一个保护性的外层之间,将 DNA 与环境隔离开来。在 60°C 和 50%相对湿度的快速老化测试中,发现保存在这种材料中的 DNA 比未保护的 DNA 稳定得多,预计在环境温度下的半衰期超过 60 年。尽管如此,由于有机硅材料骨架中存在二硫键连接体,在还原剂(TCEP 和谷胱甘肽)存在的情况下,颗粒会降解,并在模拟堆肥环境中在几天内解体,这被用来测试材料的生物降解性。这与在纯 SiO 颗粒中采用最先进的程序封装的 DNA 形成对比,后者在研究的时间框架和条件下不会生物降解。研究结果表明,包含二硫键的有机硅颗粒中保护的合成 DNA 提供了一种策略,可在完全可生物降解的格式下以高存储容量长期存储数字数据。