Lu Chao, Chen Xi
Department of Earth and Environmental Engineering, Columbia University, New York, NY, 10027, USA.
School of Chemical Engineering, Northwest University, Xi'an, Shaanxi, 710069, China.
Commun Chem. 2020 Feb 21;3(1):23. doi: 10.1038/s42004-020-0272-7.
Flexible supercapacitors have been demonstrated to be ideal energy storage devices owing to their lightweight and flexible nature and their high power density. However, conventional film-shaped devices struggle to meet the requirements of application in complicated situations, including medical instruments and wearable electronics. Here we report a hollow-structured flexible tubular supercapacitor prepared from a scalable method with the same diameter as electric wires. This new supercapacitor design allows for a large specific capacitance of 102 F g at a current density of 1 A g with excellent air-working stability over 10,000 cycles. It also shows a high energy density of 14.2 Wh kg with good rate capability even at a current density of 10 A g, which is superior to commercial devices (3-10 Wh kg). Moreover, the device delivers a stable energy storage capacity when encountering different flexible conditions, such as elongated, tangled and bent states, showing wide potentials in flexible and even wearable applications. Especially, it retains stable specific capacitance even after 500 bending cycles with a bending angle of 180°. The two-step fabrication method of these flexible tubular supercapacitors may allow for possible mass production, as they could be easily integrated with other functional components, and used in realistic scenarios that conventional film devices struggle to realize.
由于其轻质、灵活的特性以及高功率密度,柔性超级电容器已被证明是理想的储能设备。然而,传统的薄膜状器件难以满足在复杂情况下的应用需求,包括医疗仪器和可穿戴电子产品。在此,我们报告一种采用可扩展方法制备的空心结构柔性管状超级电容器,其直径与电线相同。这种新型超级电容器设计在1 A g的电流密度下具有102 F g的大比电容,在超过10000次循环中具有出色的空气工作稳定性。即使在10 A g的电流密度下,它也显示出14.2 Wh kg的高能量密度和良好的倍率性能,优于商业器件(3 - 10 Wh kg)。此外,该器件在遇到不同的柔性条件时,如伸长、缠绕和弯曲状态,仍能提供稳定的储能容量,在柔性甚至可穿戴应用中显示出广阔的潜力。特别是,即使在180°弯曲角下经过500次弯曲循环后,它仍保持稳定的比电容。这些柔性管状超级电容器的两步制造方法可能允许大规模生产,因为它们可以很容易地与其他功能组件集成,并用于传统薄膜器件难以实现的实际场景中。