Liu Xiaolong, Sun Yunlong, Chen Yue, Zhao Zhongfu, Wang Zhipeng, Zhou Guangyuan
State Key Laboratory of Fine Chemicals, School of Chemical Engineering, Dalian University of Technology, Dalian, China.
Division of Energy Materials (DNL22), Dalian Institute of Chemical Physics of the Chinese Academy of Sciences, Dalian, China.
Des Monomers Polym. 2023 Apr 29;26(1):140-149. doi: 10.1080/15685551.2023.2205733. eCollection 2023.
The high-frequency and high-speed communication in the 5 G era puts forward requirements for the dielectric properties of polymers. Introducing fluorine into poly(ary ether ketone) can improve its dielectric properties. In this work, by introducing the fluorine group strategy, we successfully designed and synthesized three novel trifluoromethyl (-CF) or trifluoromethoxy (-OCF)-containing bisphenol monomers and their F-substitution PEK-based polymers (PEK-Ins). All these PEK-Ins exhibited good thermal, mechanical and dielectric properties. The T d5% of the three polymers is all higher than 520℃. The free volume fraction of novel polymers increased from 3.75% to 5.72%. Among the three polymers, exhibited the lowest dielectric constant of the films is 2.839, and the dielectric loss is 0.0048, ascribing to the increasing free volume. The Young's modulus of the polymer film is as high as 2.9 GPa and the tensile strength is as high as 84 MPa. PEK-Ins reduced the dielectric constant by introducing a low fluorine content. This study provides a new way to design PEK to synthesize low dielectric constant polymers.
5G时代的高频高速通信对聚合物的介电性能提出了要求。将氟引入聚芳醚酮可以改善其介电性能。在这项工作中,通过引入氟基团策略,我们成功设计并合成了三种新型含三氟甲基(-CF)或三氟甲氧基(-OCF)的双酚单体及其基于F取代PEK的聚合物(PEK-Ins)。所有这些PEK-Ins均表现出良好的热性能、机械性能和介电性能。这三种聚合物的Td5%均高于520℃。新型聚合物的自由体积分数从3.75%增加到5.72%。在这三种聚合物中,薄膜的最低介电常数为2.839,介电损耗为0.0048,这归因于自由体积的增加。聚合物薄膜的杨氏模量高达2.9 GPa,拉伸强度高达84 MPa。PEK-Ins通过引入低氟含量降低了介电常数。本研究为设计PEK以合成低介电常数聚合物提供了一种新方法。