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非侵入式和无标记的芯片上中暑阻抗监测。

Non-Invasive and Label-Free On-Chip Impedance Monitoring of Heatstroke.

机构信息

Guangzhou University of Chinese Medicine, Guangzhou 510006, China.

Guangzhou Institute of Biomedicine and Health, Chinese Academy of Sciences, Guangzhou 510530, China.

出版信息

Biosensors (Basel). 2023 Jun 27;13(7):686. doi: 10.3390/bios13070686.

Abstract

Heatstroke (HS) is a life-threatening injury requiring neurocritical care which could lead to central nervous system dysfunction and severe multiple organ failure syndrome. The cell-cell adhesion and cell permeability are two key factors for characterizing HS. To investigate the process of HS, a biochip-based electrical model was proposed and applied to HS. During the process, the value of TEER is associated with cell permeability and C which represents cell-cell adhesion decreases that are consistent with the reduction in cell-cell adhesion and cell permeability characterized by proteins (occludin, VE-Cadherin and ZO-1) and RNA level. The results imply that the model can be used to monitor the biological process and other biomedical applications.

摘要

中暑(HS)是一种危及生命的损伤,需要神经重症监护,可能导致中枢神经系统功能障碍和严重的多器官衰竭综合征。细胞间黏附力和细胞通透性是表征 HS 的两个关键因素。为了研究 HS 的发生过程,提出了一种基于生物芯片的电模型并将其应用于 HS 中。在此过程中,TEER 值与细胞通透性相关,而代表细胞间黏附力的 C 值降低,这与用蛋白(occludin、VE-Cadherin 和 ZO-1)和 RNA 水平来表征的细胞间黏附力和细胞通透性降低一致。结果表明,该模型可用于监测生物过程和其他生物医学应用。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/173b/10377158/10cd6d66c28a/biosensors-13-00686-g001.jpg

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