Xu Mengli, Zhang Xiaoling, Bai Yaqi, Wang Xuefeng, Yang Jun, Hu Ning
Key Laboratory of Biorheological Science and Technology, Ministry of Education and Bioengineering College, Chongqing University, Chongqing 400044, China.
School of Smart Health, Chongqing College of Electronic Engineering, Chongqing 401331, China.
APL Bioeng. 2024 Apr 17;8(2):026103. doi: 10.1063/5.0205100. eCollection 2024 Jun.
Cell electrofusion is a key process in many research fields, such as genetics, immunology, and cross-breeding. The electrofusion efficiency is highly dependent on the buffer osmotic pressure properties. However, the mechanism by which the buffer osmotic pressure affects cell electrofusion has not been theoretically or numerically understood. In order to explore the mechanism, the microfluidic structure with paired arc micro-cavities was first evaluated based on the numerical analysis of the transmembrane potential and the electroporation induced on biological cells when the electrofusion was performed on this structure. Then, the numerical model was used to analyze the effect of three buffer osmotic pressures on the on-chip electrofusion in terms of membrane tension and cell size. Compared to hypertonic and isotonic buffers, hypotonic buffer not only increased the reversible electroporation area in the cell-cell contact zone by 1.7 times by inducing a higher membrane tension, but also significantly reduced the applied voltage required for cell electroporation by increasing the cell size. Finally, the microfluidic chip with arc micro-cavities was fabricated and tested for electrofusion of SP2/0 cells. The results showed that no cell fusion occurred in the hypertonic buffer. The fusion efficiency in the isotonic buffer was about 7%. In the hypotonic buffer, the fusion efficiency was about 60%, which was significantly higher compared to hypertonic and isotonic buffers. The experimental results were in good agreement with the numerical analysis results.
细胞电融合是遗传学、免疫学和杂交育种等许多研究领域中的关键过程。电融合效率高度依赖于缓冲液渗透压特性。然而,缓冲液渗透压影响细胞电融合的机制在理论上或数值上尚未得到理解。为了探究该机制,首先基于对跨膜电位的数值分析以及在此结构上进行电融合时生物细胞上诱导的电穿孔,对具有成对弧形微腔的微流控结构进行了评估。然后,使用数值模型从膜张力和细胞大小方面分析了三种缓冲液渗透压对芯片上电融合的影响。与高渗和等渗缓冲液相比,低渗缓冲液不仅通过诱导更高的膜张力使细胞 - 细胞接触区的可逆电穿孔面积增加了1.7倍,而且通过增加细胞大小显著降低了细胞电穿孔所需的施加电压。最后,制造了具有弧形微腔的微流控芯片并对SP2/0细胞进行电融合测试。结果表明,在高渗缓冲液中未发生细胞融合。等渗缓冲液中的融合效率约为7%。在低渗缓冲液中,融合效率约为60%,与高渗和等渗缓冲液相比显著更高。实验结果与数值分析结果吻合良好。