Ren Wanfei, Wang Manfei, Sun Xiaoqing, Hepp Edgar, Xu Jinkai
Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun, China.
School of Mechatronic Engineering, Changchun University of Science and Technology, Changchun, China.
3D Print Addit Manuf. 2024 Apr 1;11(2):e743-e750. doi: 10.1089/3dp.2022.0238. Epub 2024 Apr 16.
Facing the rapid development of 6G communication, long-wave infrared metasurface and biomimetic microfluidics, the performance requirements for microsystems based on metal tiny structures are gradually increasing. As one of powerful methods for fabrication metal complex microstructures, localized electrochemical deposition microadditive manufacturing technology can fabricate copper metal micro overhanging structures without masks and supporting materials. In this study, the role of the microprobe cantilever (MC) in localized electrodeposition was studied. The MC can be used for precise deposition with electrolyte localized transport function and high accuracy force-displacement sensitivity. To prove this, the electrolyte flow was simulated when the MC was in bending or normal state. The simulation results can indicate the influence of turbulent flow on the electrolyte flow velocity and the pressure at the end of the pyramid. The results show that the internal flow velocity increased by 8.9% in the bending probe as compared with normal. Besides, this study analyzed the force-potential sensitivity characteristics of the MC. Using the deformation of the MC as an intermediate variable, the model of the probe tip displacement caused by the growth of the deposit and the voltage value displayed by the photodetector was mathematically established. In addition, the deposition of a single voxel was simulated by simulation process with the simulated height of 520 nm for one voxel, and the coincidence of simulation and experimental results was 93.1%. In conclusion, this method provides a new way for localized electrodeposition of complex microstructures.
面对6G通信、长波红外超表面和仿生微流体的快速发展,基于金属微结构的微系统的性能要求正在逐渐提高。作为制造金属复杂微结构的有力方法之一,局部电化学沉积微增材制造技术可以在无需掩膜和支撑材料的情况下制造铜金属微悬垂结构。在本研究中,研究了微探针悬臂(MC)在局部电沉积中的作用。MC可用于精确沉积,具有电解液局部传输功能和高精度的力-位移灵敏度。为了证明这一点,对MC处于弯曲或正常状态时的电解液流动进行了模拟。模拟结果可以表明湍流对电解液流速和金字塔端部压力的影响。结果表明,与正常状态相比,弯曲探针中的内部流速增加了8.9%。此外,本研究分析了MC的力-电位灵敏度特性。以MC的形变为中间变量,数学建立了由沉积物生长引起的探针尖端位移和光电探测器显示的电压值的模型。此外,通过模拟过程对单个体素的沉积进行了模拟,单个体素的模拟高度为520 nm,模拟结果与实验结果的吻合度为93.1%。总之,该方法为复杂微结构的局部电沉积提供了一种新途径。