Research Center of Nanoscience and Nanotechnology, College of Sciences, Shanghai University, 99 Shangda Road, Shanghai, 200444, P. R. China.
The Institute of Service-Oriented Manufacturing (Hangzhou) Ltd., Hangzhou, 311100, P. R. China.
Macromol Rapid Commun. 2024 Nov;45(22):e2400527. doi: 10.1002/marc.202400527. Epub 2024 Aug 13.
With the widespread application of highly integrated electronic devices, the urgent development of multifunctional polymer-based composite materials with high electromagnetic interference shielding effectiveness (EMI SE) and thermal conductivity capabilities is critically essential. Herein, a graphene/carbon felt/polyimide (GCF/PI) composite is prepared through constructing 3D van der Waals heterostructure by heating carbon felt and graphene at high temperature. The GCF-3/PI composite exhibits the highest through-plane thermal conductivity with 1.31 W·m·K, when the content of carbon felt and graphene is 14.1 and 1.4 wt.%, respectively. The GCF-3/PI composite material achieves a thermal conductivity that surpasses pure PI by 4.9 times. Additionally, GCF-3/PI composite shows an outstanding EMI SE of 69.4 dB compared to 33.1 dB for CF/PI at 12 GHz. The 3D van der Waals heterostructure constructed by carbon felt and graphene sheets is conducive to the formation of continuous networks, providing fast channels for the transmission of phonons and carriers. This study provides a guidance on the impact of 3D van der Waals heterostructures on the thermal and EMI shielding properties of composites.
随着高度集成的电子设备的广泛应用，迫切需要开发具有高电磁干扰屏蔽效能（EMI SE）和导热能力的多功能聚合物基复合材料。本文通过在高温下加热碳毡和石墨烯构建 3D 范德华异质结构，制备了石墨烯/碳毡/聚酰亚胺（GCF/PI）复合材料。当碳毡和石墨烯的含量分别为 14.1wt.%和 1.4wt.%时，GCF-3/PI 复合材料表现出最高的面内热导率为 1.31W·m·K。GCF-3/PI 复合材料的导热系数比纯 PI 提高了 4.9 倍。此外，与 CF/PI（在 12GHz 时为 33.1dB）相比，GCF-3/PI 复合材料的 EMI SE 高达 69.4dB。碳毡和石墨烯片构建的 3D 范德华异质结构有利于连续网络的形成，为声子和载流子的传输提供了快速通道。本研究为 3D 范德华异质结构对复合材料的热性能和 EMI 屏蔽性能的影响提供了指导。
