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通过分子束外延在InP(111)A衬底上生长的SnTe(111)薄膜中的生长条件和界面失配位错阵列

Growth Conditions and Interfacial Misfit Array in SnTe (111) Films Grown on InP (111)A Substrates by Molecular Beam Epitaxy.

作者信息

Zhang Qihua, Hilse Maria, Auker Wesley, Gray Jennifer, Law Stephanie

机构信息

Two Dimensional Crystal Consortium Materials Innovation Platform, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.

Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States.

出版信息

ACS Appl Mater Interfaces. 2024 Sep 11;16(36):48598-48606. doi: 10.1021/acsami.4c10296. Epub 2024 Aug 28.

Abstract

Tin telluride (SnTe) is an IV-VI semiconductor with a topological crystalline insulator band structure, high thermoelectric performance, and in-plane ferroelectricity. Despite its many applications, there has been little work focused on understanding the growth mechanisms of SnTe thin films. In this manuscript, we investigate the molecular beam epitaxy synthesis of SnTe (111) thin films on InP (111)A substrates. We explore the effect of substrate temperature, Te/Sn flux ratio, and growth rate on the film quality. Using a substrate temperature of 340 °C, a Te/Sn flux ratio of 3, and a growth rate of 0.48 Å/s, fully coalesced and single crystalline SnTe (111) epitaxial layers with X-ray rocking curve full-width-at-half-maxima of 0.09° and root-mean-square surface roughness as low as 0.2 nm have been obtained. Despite the 7.5% lattice mismatch between the SnTe (111) film and the InP (111)A substrate, reciprocal space mapping indicates that the 15 nm SnTe layer is fully relaxed. We show that a periodic interfacial misfit (IMF) dislocation array forms at the SnTe/InP heterointerface, where each IMF dislocation is separated by 14 InP lattice sites/13 SnTe lattice sites, providing rapid strain relaxation and yielding the high quality SnTe layer. This is the first report of an IMF array forming in a rock-salt on zinc-blende material system and at an IV-VI on III-V heterointerface, and highlights the potential for SnTe as a buffer layer for epitaxial telluride film growth. This work represents an important milestone in enabling the heterointegration between IV-VI and III-V semiconductors to create multifunctional devices.

摘要

碲化锡(SnTe)是一种具有拓扑晶体绝缘体能带结构、高热电性能和面内铁电性的IV-VI族半导体。尽管它有许多应用,但很少有工作专注于理解SnTe薄膜的生长机制。在本论文中,我们研究了在InP(111)A衬底上通过分子束外延法合成SnTe(111)薄膜。我们探讨了衬底温度、Te/Sn通量比和生长速率对薄膜质量的影响。使用340°C的衬底温度、3的Te/Sn通量比和0.48 Å/s的生长速率,已获得了完全合并且单晶的SnTe(111)外延层,其X射线摇摆曲线半高宽为0.09°,均方根表面粗糙度低至0.2 nm。尽管SnTe(111)薄膜与InP(111)A衬底之间存在7.5%的晶格失配,但倒易空间映射表明15 nm厚的SnTe层完全弛豫。我们表明,在SnTe/InP异质界面处形成了周期性界面失配位错(IMF)阵列,其中每个IMF位错由14个InP晶格位点/13个SnTe晶格位点隔开,提供了快速的应变弛豫并产生了高质量的SnTe层。这是首次报道在闪锌矿材料体系上的岩盐结构中以及在III-V族衬底上的IV-VI族异质界面处形成IMF阵列,并突出了SnTe作为碲化物外延薄膜生长缓冲层的潜力。这项工作代表了实现IV-VI族和III-V族半导体之间异质集成以制造多功能器件的一个重要里程碑。

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