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采用均匀低能电子束辐照(HLEBI)对3D打印短碳纤维增强聚酰胺(3D-SCFRPA66)进行新型处理及提高延展性

Novel Treatment of 3D-Printed Short-Carbon-Fiber-Reinforced Polyamide (3D-SCFRPA66) Using Homogeneous Low-Potential Electron Beam Irradiation (HLEBI) and Ductility Enhancement.

作者信息

Miura Eiichi, Uchida Helmut Takahiro, Okazaki Taisuke, Sagawa Kohei, Faudree Michael C, Salvia Michelle, Kimura Hideki, Nishi Yoshitake

机构信息

KISTEC (Kanagawa Institute of Industrial Science & Technology), 705-1, Shimoimaizumi, Ebina 243-0435, Japan.

Graduate School of Engineering, Tokai University, 4-1, Kitakaname, Hiratsuka 259-1292, Japan.

出版信息

Polymers (Basel). 2024 Dec 3;16(23):3408. doi: 10.3390/polym16233408.

Abstract

In short-carbon-fiber-reinforced polyamide 66 articles shaped by 3D printing (3D-SCFRPA66), the interfaces between printed layers are often susceptible to damage, and the composite is excessively brittle. Therefore, a novel treatment for 3D-printed short-carbon-fiber-reinforced polyamide (3D-SCFRPA66) using homogeneous low-potential electron beam irradiation (HLEBI) to enhance tensile properties was investigated. In 3D-SCFRPA66 samples, ductility was measured based on the following parameters: strain at tensile strength (corresponding to homogeneous deformation) () and resistance energy to homogeneous deformation, a measure of toughness (), which were both substantially increased. An HLEBI dose of 43.2 kGy at an acceleration potential of 210 kV for the finished 3D-SCFRPA66 samples increased the and values from 0.031 and 1.20 MPa·m for the untreated samples to 0.270 and 6.05 MPa·m for the treated samples, increases of 771% and 504%, respectively. Higher HLEBI doses of 86, 129, or 215 kGy also increased the and values to lesser degrees. Electron spin resonance (ESR) data in the literature show that HLEBI creates dangling bonds in Nylon 6. Since PA66 and Nylon 6 are constructed of C, N, and O and have similar molecular structures, HLEBI apparently severs the (-C-N-) bonds in the backbone of PA66, which have the lowest bond-dissociation energy (BDE) of ~326 to 335 kJ mol. This shortens the PA66 chains for higher ductility. In addition, for Nylon 6, X-ray photoelectron spectroscopy (XPS) data in the literature show that HLEBI reduces the N peak while increasing the C peak, indicating the occurrence of shortening chains via dangling bond formation accompanied by increases in crosslinking with carbon bonds. However, caution is advised, since HLEBI was found to decrease the tensile strength () and initial elasticity ([d/d]) of 3D-SCFRPA66. This tradeoff can possibly allow the HLEBI dose to be adjusted for the desired ductility and strength while minimizing energy consumption.

摘要

在通过3D打印成型的短碳纤维增强聚酰胺66制品(3D-SCFRPA66)中,打印层之间的界面往往容易受损,且该复合材料过于脆硬。因此,研究了一种使用均匀低电位电子束辐照(HLEBI)来增强拉伸性能的新型3D打印短碳纤维增强聚酰胺(3D-SCFRPA66)处理方法。在3D-SCFRPA66样品中,基于以下参数测量延展性:拉伸强度下的应变(对应均匀变形)()和均匀变形的阻力能量,即韧性的一种度量(),这两个参数均大幅增加。对于成品3D-SCFRPA66样品,在210 kV的加速电位下施加43.2 kGy的HLEBI剂量,使未处理样品的和值从0.031和1.20 MPa·m分别增加到处理后样品的0.270和6.05 MPa·m,分别增加了771%和504%。86、129或215 kGy的更高HLEBI剂量也在较小程度上增加了和值。文献中的电子自旋共振(ESR)数据表明,HLEBI在尼龙6中产生悬空键。由于PA66和尼龙6由C、N和O构成且具有相似的分子结构,HLEBI显然切断了PA66主链中的(-C-N-)键,其键解离能(BDE)最低,约为326至335 kJ/mol。这缩短了PA66链以提高延展性。此外,对于尼龙6,文献中的X射线光电子能谱(XPS)数据表明,HLEBI降低了N峰同时增加了C峰,表明通过悬空键形成伴随与碳键交联增加而发生链缩短。然而,建议谨慎操作,因为发现HLEBI会降低3D-SCFRPA66的拉伸强度()和初始弹性([d/d])。这种权衡可能允许根据所需的延展性和强度调整HLEBI剂量,同时将能耗降至最低。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4f03/11644372/0123303904f0/polymers-16-03408-g001.jpg

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