Effect of AF Surface Nanostructure on AFRP Interface Properties Under Temperature: A MD Simulation Study.

The insulating rod of aramid fiber-reinforced epoxy resin composites (AFRP) is an important component of gas-insulated switchgear (GIS). Under complex working conditions, the high temperature caused by voltage, current, and external climate change becomes one of the important factors that aggravate the interface degradation between aramid fiber (AF) and epoxy resin (EP). In this paper, molecular dynamics (MD) simulation software is used to study the effect of temperature on the interfacial properties of AF/EP. At the same time, the mechanism of improving the interfacial properties of three nanoparticles with different properties (insulator AlO, semiconductor ZnO, and conductor carbon nanotube (CNT)) is explored. The results show that the increase in temperature will greatly reduce the interfacial van der Waals force, thereby reducing the interfacial binding energy between AF and EP, making the interfacial wettability worse. Furthermore, the addition of the three fillers can improve the interfacial adhesion of the composite material. Among them, AlO and CNT maintain a large dipole moment at high temperature, making the van der Waals force more stable and the adhesion performance attenuation less. The Mulliken charge and energy gap of AlO and ZnO decrease slightly with temperature but are still higher than AF, which is conducive to maintaining good interfacial insulation performance.