Yang Yutao, Mao Minmin, Xu Junran, Liu Huan, Wang Jianhua, Song Kaixin
College of Electronic Information and Engineering, Hangzhou Dianzi University, Hangzhou 310018, China.
School of Electronic Engineering, Hangzhou Dianzi University Information Engineering College, Hangzhou 311305, China.
Sensors (Basel). 2025 Sep 2;25(17):5424. doi: 10.3390/s25175424.
With the rapid evolution of 5G wireless communications, millimeter-wave (mmWave) technology has become a crucial enabler for high-speed, low-latency, and large-scale connectivity. As the critical interface for signal transmission, mmWave antennas directly affect system performance, reliability, and application scope. This paper reviews the current state of mmWave antenna technologies in 5G systems, focusing on antenna types, design considerations, and integration strategies. We discuss how the multiple-input multiple-output (MIMO) architectures and advanced beamforming techniques enhance system capacity and link robustness. State-of-the-art integration methods, such as antenna-in-package (AiP) and chip-level integration, are examined for their importance in achieving compact and high-performance mmWave systems. Material selection and fabrication technologies-including low-loss substrates like polytetrafluoroethylene (PTFE), hydrocarbon-based materials, liquid crystal polymer (LCP), and microwave dielectric ceramics, as well as emerging processes such as low-temperature co-fired ceramics (LTCC), 3D printing, and micro-electro-mechanical systems (MEMS)-are also analyzed. Key challenges include propagation path limitations, power consumption and thermal management in highly integrated systems, cost-performance trade-offs for mass production, and interoperability standardization across vendors. Finally, we outline future research directions, including intelligent beam management, reconfigurable antennas, AI-driven designs, and hybrid mmWave-sub-6 GHz systems, highlighting the vital role of mmWave antennas in shaping next-generation wireless networks.
随着5G无线通信的迅速发展，毫米波（mmWave）技术已成为实现高速、低延迟和大规模连接的关键推动因素。作为信号传输的关键接口，毫米波天线直接影响系统性能、可靠性和应用范围。本文综述了5G系统中毫米波天线技术的现状，重点关注天线类型、设计考量和集成策略。我们讨论了多输入多输出（MIMO）架构和先进的波束成形技术如何提高系统容量和链路鲁棒性。研究了诸如封装天线（AiP）和芯片级集成等先进的集成方法在实现紧凑和高性能毫米波系统方面的重要性。还分析了材料选择和制造技术，包括聚四氟乙烯（PTFE）、碳氢化合物基材料、液晶聚合物（LCP）和微波介质陶瓷等低损耗基板，以及低温共烧陶瓷（LTCC）、3D打印和微机电系统（MEMS）等新兴工艺。关键挑战包括传播路径限制、高度集成系统中的功耗和热管理、大规模生产中的性价比权衡以及不同供应商之间的互操作性标准化。最后，我们概述了未来的研究方向，包括智能波束管理、可重构天线、人工智能驱动的设计以及毫米波与低于6GHz混合系统，强调了毫米波天线在塑造下一代无线网络中的重要作用。
