基于X射线光电子能谱显微镜对图案化和摩擦聚酰亚胺表面取向的研究

X-PEEM Study on Surface Orientation of Stylized and Rubbed Polyimides.

作者信息

Cossy-Favre A, Díaz J, Liu Y, Brown HR, Samant MG, Stöhr J, Hanna AJ, Anders S, Russell TP

机构信息

Advanced Light Source, Lawrence Berkeley National Laboratory, 1 Cyclotron Road, Berkeley, California 94720, Department of Polymer Science and Engineering, University of Massachusetts, Amherst, Massachusetts 01003, BHP Steel Institute, University of Wollongong, Wollongong NSW 2522, Australia, and Almaden Research Center, IBM Research Division, San Jose, California 95120.

出版信息

Macromolecules. 1998 Jul 28;31(15):4957-62. doi: 10.1021/ma980029b.

DOI:10.1021/ma980029b

PMID:9680434

Abstract

X-ray photoelectron emission microscopy (X-PEEM) was used to study the surface orientation of stylized and rubbed polyimide thin films. Using soft X-rays produced by a synchrotron light source, this technique combines high spatial resolution imaging with near-edge X-ray absorption fine structure (NEXAFS) spectroscopy to yield information on the surface orientation of the films. Stylizing is an ideal model of the rubbing process since the local stress acting on the polyimide to orient the molecules can be calculated. The minimum normal stress necessary to orient the surface of BPDA-PDA films was found to be 45 MPa much lower than the bulk yield stress of 200-300 MPa. Studies of the polyimide films oriented by the conventional rubbing method showed lateral inhomogeneities in the orientation of the polymer at the surface.

摘要

利用X射线光电子发射显微镜（X-PEEM）研究了程式化和摩擦处理的聚酰亚胺薄膜的表面取向。该技术利用同步辐射光源产生的软X射线，将高空间分辨率成像与近边X射线吸收精细结构（NEXAFS）光谱相结合，以获取有关薄膜表面取向的信息。程式化是摩擦过程的理想模型，因为可以计算作用于聚酰亚胺以使分子取向的局部应力。发现使BPDA-PDA薄膜表面取向所需的最小法向应力为45 MPa，远低于200-300 MPa的本体屈服应力。对通过传统摩擦方法取向的聚酰亚胺薄膜的研究表明，聚合物在表面的取向存在横向不均匀性。