Yasuda K, Kanzawa Y
Bull Tokyo Med Dent Univ. 1975 Mar;22(1):101-11.
The ordering process in gold-copper-silver dental alloys was studied by means of isochoronal and isothermal resistivity measurement. Because the stable existing temperature range of orthorhombic superlattice was unexpectedly extended to lower temperature by the addition of silver to gold-copper binary alloy, the ordering velocity in these alloys are considerably slower than that of binary stoichiometric AuCu alloy. Activation energy, the order of the reaction, and rate constant for growing process were established. The difference in growing mechanisms depending on gold concentration was deduced from the kinetics data.
通过等容和等温电阻率测量研究了金-铜-银牙科合金中的有序化过程。由于向金-铜二元合金中添加银意外地将正交超晶格的稳定存在温度范围扩展到了更低温度，这些合金中的有序化速度比二元化学计量比的AuCu合金慢得多。确定了激活能、反应级数和生长过程的速率常数。从动力学数据推断出了取决于金浓度的生长机制差异。
