Bagis Y H, Rueggeberg F A
University of Ankara School of Dentistry, Ankara, Turkey.
Dent Mater. 2000 Jul;16(4):244-7. doi: 10.1016/s0109-5641(00)00006-3.
This paper examined the influence of post-cure temperature on the amount of unreacted monomer remaining in a commercial light-cured resin composite restoration following initial light-curing and subsequent post-cure heating.
Discs of composite were light-cured and then subjected to immediate post-cure heating (50, 75, 100, or 125 degrees C for 7 min) or were left unheated (control). They were then placed in a solvent for two weeks at 37 degrees C to extract the unreacted monomer. HPLC analysis was used to determine the amounts of TEGDMA, BIS-GMA, and ethoxylated BIS-GMA remaining after the different treatments. The amounts of each monomer leaching were compared using ANOVA with respect to the different curing treatments.
Even the lowest post-cure heat treatment (50 degrees C) resulted in 80% reduction in remaining, unreacted TEGDMA, 75% reduction in BIS-GMA, and 77% lower ethoxylated BIS-GMA than the light-cured only control. Post-cure heating at 75 degrees C and above resulted in the lowest amount of each type monomer remaining uncured in the polymer and did not significantly decrease with an increase in post-cure temperature for the most part.
One of the main benefits of post-cure heating of resin composite restorations could be the enhancement of biocompatibility of these restorations as a result of the significant decrease in potentially leachable, unreacted monomer.
本文研究了后固化温度对商业光固化树脂复合材料修复体在初始光固化和随后的后固化加热后残留未反应单体量的影响。
将复合材料圆盘进行光固化，然后立即进行后固化加热（50、75、100或125摄氏度，持续7分钟），或不加热（对照）。然后将它们在37摄氏度的溶剂中放置两周，以提取未反应的单体。采用高效液相色谱分析来测定不同处理后残留的TEGDMA、BIS - GMA和乙氧基化BIS - GMA的量。使用方差分析比较不同固化处理下每种单体的浸出量。
即使是最低的后固化热处理（50摄氏度），与仅光固化的对照相比，残留的未反应TEGDMA减少了80%，BIS - GMA减少了75%，乙氧基化BIS - GMA减少了77%。75摄氏度及以上的后固化加热导致聚合物中每种未固化单体的残留量最低，并且在很大程度上不会随着后固化温度的升高而显著降低。
树脂复合材料修复体后固化加热的主要益处之一可能是由于潜在可浸出的未反应单体显著减少，从而提高了这些修复体的生物相容性。
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