Pinkett Shawn L, Hunt William D, Barber Bradley P, Gammel Peter L
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA.
IEEE Trans Ultrason Ferroelectr Freq Control. 2002 Nov;49(11):1491-6. doi: 10.1109/tuffc.2002.1049730.
Thin film bulk acoustic wave (BAW) resonators have been the subject of research in RF microelectronics for some time. Much of the interest lay in utilizing the resonators to design filters for wireless applications. Some of the major advantages BAW devices present over other filter technologies in use today include size reduction and the possibility of on-chip integration. As the technology matures, the necessity to more fully characterize the performance of the devices and to develop more accurate models describing their behavior is apparent. In this investigation, the effects that temperature variations have on 1.8-2.0 GHz zinc oxide (ZnO)-based solidly mounted BAW resonators (SMRs) are studied. The average temperature coefficients of the series and parallel resonant frequencies of the fabricated devices are found to be -31.5 ppm/degrees C and -35.3 ppm/degrees C, respectively. The slight decrease in separation between the two resonant frequencies with temperature implies there is slightly less effective coupling with increased temperature. No definite trend is found describing the behavior of the quality factor (Q) of the resonator with temperature variations. With little temperature coefficient data for thin film ZnO available in the literature, the importance of an accurate model is evident. The resonator device performance is simulated using Ballato's electronic circuit model for acoustic devices on a SPICE-based platform. By virtue of the comparison between the predicted and measured device response, various material parameters are extracted.
薄膜体声波(BAW)谐振器在射频微电子领域已成为研究对象有一段时间了。其中很大一部分兴趣在于利用这些谐振器设计用于无线应用的滤波器。与当今使用的其他滤波器技术相比,BAW器件的一些主要优势包括尺寸减小以及片上集成的可能性。随着技术的成熟,更全面地表征器件性能并开发更准确描述其行为的模型的必要性变得显而易见。在本研究中,研究了温度变化对基于1.8 - 2.0 GHz氧化锌(ZnO)的固态安装BAW谐振器(SMR)的影响。发现所制造器件的串联和并联谐振频率的平均温度系数分别为-31.5 ppm/℃和-35.3 ppm/℃。两个谐振频率之间的间距随温度略有减小,这意味着随着温度升高,有效耦合略有减少。未发现描述谐振器品质因数(Q)随温度变化行为的明确趋势。鉴于文献中关于薄膜ZnO的温度系数数据很少,准确模型的重要性显而易见。在基于SPICE的平台上,使用Ballato的声学器件电子电路模型对谐振器器件性能进行了模拟。通过比较预测的和测量的器件响应,提取了各种材料参数。