Cheong C, King N M, Pashley D H, Ferrari M, Toledano M, Tay F R
Pediatric Dentistry and Orthodontics, University of Hong Kong, Hong Kong SAR, China.
Oper Dent. 2003 Nov-Dec;28(6):747-55.
This study tested the null hypothesis that there no difference between two-step and one-step self-etch adhesives in their compatibility with these composites. The microtensile bond strengths (microTBS) of two two-step systems (Clearfil SE Bond, Kuraray and Tyrian SPE/One-Step Plus, BISCO) were compared with two one-step systems (Xeno III, Dentsply DeTrey and Brush&Bond, Parkell) for their coupling to a dual-cured composite. Silver tracer penetration of the four adhesives bonded to a light-cured or a chemical-cured composite was examined using TEM. Significant differences in microTBSs between composite curing modes were seen only in the one-step adhesives. For one-step self-etch adhesives bonded to the chemical-cured composite, TEM revealed signs of frank composite uncoupling along the adhesive-composite interface, which may be attributed to the adverse chemical interaction between the acidic adhesive and the composite. In addition, "water trees" that represent channels of increased permeability with the polymerized adhesive layer were also observed in the one-step adhesives. Both features were absent along the resin-dentin interfaces when chemical-cured composites were coupled to the two-step self-etch adhesives.
本研究检验了一个零假设，即两步法自酸蚀粘结剂和一步法自酸蚀粘结剂与这些复合材料的相容性不存在差异。将两种两步法系统（可乐丽公司的Clearfil SE Bond和必思科公司的Tyrian SPE/One-Step Plus）的微拉伸粘结强度（microTBS）与两种一步法系统（登士柏德瑞公司的Xeno III和帕凯尔公司的Brush&Bond）与双固化复合材料的结合情况进行了比较。使用透射电子显微镜（TEM）检查了与光固化或化学固化复合材料粘结的四种粘结剂的银示踪剂渗透情况。仅在一步法粘结剂中观察到复合材料固化方式之间的microTBS存在显著差异。对于粘结到化学固化复合材料上的一步法自酸蚀粘结剂，TEM显示在粘结剂-复合材料界面处有明显的复合材料脱粘迹象，这可能归因于酸性粘结剂与复合材料之间的不利化学相互作用。此外，在一步法粘结剂中还观察到了“水树”，其代表了聚合粘结剂层中渗透性增加的通道。当化学固化复合材料与两步法自酸蚀粘结剂结合时，在树脂-牙本质界面处未观察到这两种特征。
