Dedeloudis C, Fransaer J
Department of Metallurgy and Materials Engineering, Katholieke Universiteit Leuven, 3001 Heverlee, Belgium.
Langmuir. 2004 Dec 7;20(25):11030-8. doi: 10.1021/la0362066.
In this paper, the behavior of polystyrene and glass particles on a copper electrode during the electrodeposition of copper was studied using an atomic force microscope (AFM). Polystyrene or glass particles glued to the tip of the AFM cantilever were kept in contact with the surface of the electrode. The surface forces between the polystyrene or glass particle and the copper electrode were measured before, during, and after electrodeposition. These experiments revealed that glass particles do not make contact with the electrode, probably due to the repulsive hydration force. Polystyrene particles, on the other hand, make contact with the electrode, due to the attractive hydrophobic force. The AFM experiments were correlated with sedimentation co-deposition experiments of polystyrene and glass particles with copper. It was found that 80% of the polystyrene particles added to the plating solution incorporated with copper, while only 0.25% of the glass particles co-deposited under the same conditions.
在本文中，使用原子力显微镜（AFM）研究了聚苯乙烯和玻璃颗粒在铜电极上铜电沉积过程中的行为。粘贴在AFM悬臂尖端的聚苯乙烯或玻璃颗粒与电极表面保持接触。在电沉积之前、期间和之后测量了聚苯乙烯或玻璃颗粒与铜电极之间的表面力。这些实验表明，玻璃颗粒可能由于排斥性水化力而不与电极接触。另一方面，由于吸引性疏水力，聚苯乙烯颗粒与电极接触。AFM实验与聚苯乙烯和玻璃颗粒与铜的沉降共沉积实验相关。结果发现，添加到镀液中的聚苯乙烯颗粒有80%与铜共沉积，而在相同条件下只有0.25%的玻璃颗粒共沉积。
