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用于三维定量组织学的光学计算机断层扫描显微镜。

Optical computed-tomographic microscope for three-dimensional quantitative histology.

作者信息

Chamgoulov Ravil, Lane Pierre, MacAulay Calum

机构信息

Cancer Imaging Department, BC Cancer Research Centre, Vancouver, Canada.

出版信息

Cell Oncol. 2004;26(5-6):319-27. doi: 10.1155/2004/209579.

DOI:10.1155/2004/209579
PMID:15623942
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC4612262/
Abstract

A novel optical computed-tomographic microscope has been developed allowing quantitative three-dimensional (3D) imaging and analysis of fixed pathological material. Rather than a conventional two-dimensional (2D) image, the instrument produces a 3D representation of fixed absorption-stained material, from which quantitative histopathological features can be measured more accurately. The accurate quantification of these features is critically important in disease diagnosis and the clinical classification of cancer. The system consists of two high NA objective lenses, a light source, a digital spatial light modulator (DMD, by Texas Instrument), an x-y stage, and a CCD detector. The DMD, positioned at the back pupil-plane of the illumination objective, is employed to illuminate the specimen with parallel rays at any desired angle. The system uses a modification of the convolution backprojection algorithm for reconstruction. In contrast to fluorescent images acquired by a confocal microscope, this instrument produces 3D images of absorption stained material. Microscopic 3D volume reconstructions of absorption-stained cells have been demonstrated. Reconstructed 3D images of individual cells and tissue can be cut virtually with the distance between the axial slices less than 0.5 microm.

摘要

一种新型光学计算机断层扫描显微镜已被开发出来,可对固定的病理材料进行定量三维(3D)成像和分析。该仪器生成的不是传统的二维(2D)图像,而是固定的吸收染色材料的3D表示,从中可以更准确地测量定量组织病理学特征。这些特征的准确量化在疾病诊断和癌症临床分类中至关重要。该系统由两个高数值孔径物镜、一个光源、一个数字空间光调制器(德州仪器的DMD)、一个x-y平台和一个电荷耦合器件(CCD)探测器组成。位于照明物镜后焦平面的DMD用于以任何所需角度用平行光线照射标本。该系统使用卷积反投影算法的一种改进进行重建。与共聚焦显微镜获取的荧光图像不同,该仪器生成吸收染色材料的3D图像。已展示了吸收染色细胞的微观3D体积重建。单个细胞和组织的重建3D图像可以进行虚拟切割,轴向切片之间的距离小于0.5微米。