通过对球形二氧化硅颗粒进行包埋和选择性蚀刻制备亚微米级环。

The preparation of submicrometer-sized rings by embedding and selective etching of spherical silica particles.

作者信息

Marczewski Dawid, Goedel Werner A

机构信息

Organic and Macromolecular Chemistry, University of Ulm, Germany.

出版信息

Nano Lett. 2005 Feb;5(2):295-9. doi: 10.1021/nl0481021.

DOI:10.1021/nl0481021

PMID:15794614

Abstract

Silica particles were embedded in a polymer layer on a water surface in such a way that they protruded out of the top and the bottom surfaces. Etching of this layer with hydrofluoric acid vapors gradually removed the particles to yield membranes with pores that continuously widen until the particles are completely removed. Removing the polymer at intermediate stages of etching revealed that the particles are first converted into rings and sickles before they are finally completely destroyed.

摘要

二氧化硅颗粒以突出于顶部和底部表面的方式嵌入水表面的聚合物层中。用氢氟酸蒸汽蚀刻该层会逐渐去除颗粒，从而产生具有不断扩大的孔隙的膜，直到颗粒被完全去除。在蚀刻的中间阶段去除聚合物表明，颗粒在最终被完全破坏之前首先会转化为环和镰刀状。