Wallman C, Afseth J, Emilson C G
Department of Cariology, Faculty of Odontology, University of Göteborg, Sweden.
Acta Odontol Scand. 1992 Apr;50(2):79-82. doi: 10.3109/00016359209012749.
Differences in copper concentrations found in plaque adjacent to conventional compared with copper-rich non-gamma-2 amalgam fillings were evaluated. Plaque was sampled at baseline and up to 2 months after polishing of two to four fillings of each type of amalgam in six patients. Copper concentrations of several hundred ppm were found, with higher values in plaque sampled from copper-rich amalgam. However, the copper release from the copper-rich amalgam probably has very little influence on plaque ecology owing to a relatively low copper ion activity because of stable copper complexes in plaque.
评估了与富含铜的非γ-2汞合金填充物相比，传统汞合金填充物附近菌斑中铜浓度的差异。对6名患者的每种汞合金的两到四颗填充物进行抛光，在基线和抛光后长达2个月时采集菌斑样本。发现铜浓度为几百ppm，从富含铜的汞合金中采集的菌斑中铜浓度更高。然而，由于菌斑中稳定的铜络合物导致铜离子活性相对较低，富含铜的汞合金释放的铜可能对菌斑生态影响很小。
