Zheng Yi, Cloutier Pierre, Hunting Darel J, Sanche Léon, Wagner J Richard
Group in the Radiation Sciences, Faculty of Medicine, Université de Sherbrooke, Sherbrooke, Québec, Canada J1H 5N4.
J Am Chem Soc. 2005 Nov 30;127(47):16592-8. doi: 10.1021/ja054129q.
DNA damage by low-energy electrons (LEE) was examined using a novel system in which thin solid films of oligonucleotide tetramers (CGTA and GCAT) were irradiated with monoenergetic electrons (10 eV) under ultrahigh vacuum. The products of irradiation were examined by HPLC. These analyses permitted the quantitation of 16 nonmodified nucleobase, nucleoside, and nucleotide fragments of each tetramer resulting from the cleavage of phosphodiester and N-glycosidic bonds. The distribution of nonmodified products suggests a mechanism of damage involving initial electron attachment to nucleobase moieties, followed by electron transfer to the sugar-phosphate backbone, and subsequent dissociation of the phosphodiester bond. Moreover, virtually all the nonmodified fragments contained a terminal phosphate group at the site of cleavage. These results demonstrate that the phosphodiester bond breaks by a distinct pathway in which the negative charge localizes on the phosphodiester bond giving rise to nonmodified fragments with an intact phosphate group. Conversely, the radical must localize on the sugar moiety to give as yet unidentified modifications. In summary, the reaction of LEE with simple tetramers involved dissociative electron attachment leading to phosphodiester bond cleavage and the formation of nonmodified fragments.
利用一种新型系统研究了低能电子(LEE)对DNA的损伤,该系统是在超高真空条件下,用单能电子(10 eV)辐照寡核苷酸四聚体(CGTA和GCAT)的固体薄膜。通过高效液相色谱法(HPLC)检测辐照产物。这些分析能够对每个四聚体因磷酸二酯键和N-糖苷键断裂产生的16种未修饰的核碱基、核苷和核苷酸片段进行定量。未修饰产物的分布表明了一种损伤机制,即最初电子附着于核碱基部分,随后电子转移至糖磷酸主链,接着磷酸二酯键发生解离。此外,几乎所有未修饰片段在裂解位点都含有一个末端磷酸基团。这些结果表明,磷酸二酯键通过一种独特的途径断裂,其中负电荷定位于磷酸二酯键上,从而产生具有完整磷酸基团的未修饰片段。相反,自由基必须定位于糖部分才能产生尚未鉴定的修饰。总之,LEE与简单四聚体的反应涉及解离电子附着,导致磷酸二酯键断裂并形成未修饰片段。