Seo Yongsok, Ninh Tran Hai, Hong Soon Man, Kim Sehyun, Kang Tae Jin, Kim Hansung, Kim Jinyeol
School of Materials Science and Engineering and Intellectual Textile System Research Center (ITRC), College of Engineering, Seoul National University, Shillim9dong 56-1, Kwanakgu, Seoul, Korea 151-744.
Langmuir. 2006 Mar 28;22(7):3062-7. doi: 10.1021/la051918c.
We present an investigation of the interfacial reinforcement between a flexible folded-chain polymer (functionalized polypropylene-maleic anhydride-grafted polypropylene, MAPP) and a rodlike polymer (a themotropic liquid crystalline polymer, TCLP - poly(ester amide)). Fracture toughness was measured using an asymmetric double-cantilever beam test (ADCB). High fracture toughness at the bonding temperature of 200 degrees C indicates that a chemical reaction has occurred at the interface to provide a strong interaction between MAPP and TLCP. Despite the higher modulus of TLCP, the fracture was propagated in the TLCP phase because of inherent TLCP domain structure. An analysis on the locus of failure revealed that at constant bonding temperature the fracture toughness between MAPP and TLCP was influenced not only by the bonding temperature but also by the bonding time. The fracture toughness increased with the bonding temperature until 200 degrees C was reached and then decreased at higher bonding temperature. The fracture toughness increased with annealing time until it reached a plateau value. We ascribe the dependence of the fracture toughness on the bonding time to the progressive occurrence of two different failure mechanisms, adhesive failure and cohesive failure. The adhesive strength increased with bonding temperature whereas the cohesive strength decreased because of weaker adhesion between TLCP crystalline domains. The dependence of fracture toughness on bonding time was explained in terms of the TLCP crystalline domain structure.
我们展示了一项关于柔性折叠链聚合物(官能化聚丙烯 - 马来酸酐接枝聚丙烯,MAPP)与棒状聚合物(热致液晶聚合物,TCLP - 聚(酯酰胺))之间界面增强的研究。使用不对称双悬臂梁试验(ADCB)测量断裂韧性。在200℃的粘结温度下具有高断裂韧性表明在界面处发生了化学反应,从而在MAPP和TLCP之间提供了强相互作用。尽管TLCP的模量较高,但由于TLCP固有的畴结构,断裂在TLCP相中扩展。对失效位置的分析表明,在恒定粘结温度下,MAPP和TLCP之间的断裂韧性不仅受粘结温度影响,还受粘结时间影响。断裂韧性随着粘结温度升高至200℃而增加,然后在更高的粘结温度下降低。断裂韧性随着退火时间增加直至达到平稳值。我们将断裂韧性对粘结时间的依赖性归因于两种不同失效机制(粘附失效和内聚失效)的逐步发生。粘附强度随着粘结温度升高而增加,而内聚强度由于TLCP晶畴之间较弱的粘附力而降低。根据TLCP晶畴结构解释了断裂韧性对粘结时间的依赖性。