Dryfe Robert A W
School of Chemistry, University of Manchester, Oxford Road, Manchester, UK M13 9PL.
Phys Chem Chem Phys. 2006 Apr 28;8(16):1869-83. doi: 10.1039/b518018j. Epub 2006 Mar 20.
The modification of the liquid/liquid interface with solid phases is discussed in this article. Modified interfaces can be formed with molecular assemblies, but here attention is focussed on solid materials such as mesoscopic particles, or microporous and mesoporous membranes. Charge transfer across the modified liquid/liquid interface is considered in particular. The most obvious consequence of the introduction of such modifying components is their effect on the transport to, and the transfer of material across, the liquid/liquid interface, as measured voltammetrically for example. One particularly interesting reaction is interfacial metal deposition, which can also be studied under electrochemical control: the initial formation of metal nuclei at the interface transforms it from the bare, pristine state to a modified state with very different reactivity. Deposition at interfaces between liquids is compared and contrasted with the cases of metal deposition in bulk solution and conventional heterogeneous deposition on conducting solid surfaces. Comparison is also made with work on the assembly of pre-formed micron and nanometre scale solids at the liquid/liquid interface.
本文讨论了用固相修饰液/液界面的问题。可以用分子聚集体形成修饰界面，但这里重点关注的是固体材料，如介观粒子、微孔和介孔膜。特别考虑了电荷在修饰的液/液界面上的转移。引入此类修饰成分最明显的结果是它们对物质向液/液界面的传输以及在该界面上的转移的影响，例如通过伏安法测量。一个特别有趣的反应是界面金属沉积，这也可以在电化学控制下进行研究：界面处金属核的初始形成将其从裸露的原始状态转变为具有非常不同反应性的修饰状态。将液体间界面处的沉积与本体溶液中的金属沉积以及在导电固体表面上的传统非均相沉积的情况进行了比较和对比。还与在液/液界面处预形成的微米和纳米级固体的组装工作进行了比较。
