Vicente Ascension, Bravo Luis A
Docent Unit of Orthodontics, Dental Clinic, University of Murcia, Hospital Morales Meseguer, 2a planta, Calle Marqués de los Véllez, s/n, 30008 Murcia, Spain.
Am J Dent. 2006 Aug;19(4):241-4.
To evaluate the shear bond strength and the adhesive remnant on the tooth after the debonding of APC Plus precoated brackets, when conditioning the enamel with phosphoric acid and Transbond Plus Self Etching Primer (TSEP), in comparison with uncoated brackets bonded with Transbond XT.
The brackets were bonded to extracted premolars, which were divided into three groups: (1) Acid/Transbond XT, (2) Acid/ APC Plus and (3) TSEP/APC Plus. Shear bond strength was measured using a universal test machine. The crosshead speed was 1 mm/minute. The adhesive remnant on the tooth was quantified using an image analysis equipment.
No significant differences were found in the bond strengths of the three groups evaluated (P> 0.05). The two groups in which APC Plus system was used left significantly less adhesive on the tooth than Transbond XT. TSEP/APC Plus left significantly less adhesive than Acid/APC Plus (P< 0.017).
与使用Transbond XT粘结的未涂层托槽相比,评估在使用磷酸和Transbond Plus自酸蚀底漆(TSEP)处理牙釉质时,APC Plus预涂层托槽脱粘后的剪切粘结强度和牙齿上的粘结残余物。
将托槽粘结到拔除的前磨牙上,这些前磨牙分为三组:(1)酸/Transbond XT,(2)酸/APC Plus和(3)TSEP/APC Plus。使用万能试验机测量剪切粘结强度。十字头速度为1毫米/分钟。使用图像分析设备对牙齿上的粘结残余物进行定量。
在评估的三组粘结强度中未发现显著差异(P>0.05)。使用APC Plus系统的两组在牙齿上留下的粘结物明显少于Transbond XT。TSEP/APC Plus留下的粘结物明显少于酸/APC Plus(P<0.017)。