Goede Karsten, Grundmann Marius, Holland-Nell Kai, Beck-Sickinger Annette G
Universität Leipzig, Institut für Experimentelle Physik II, Linnéstrasse 5, 04103 Leipzig, Germany.
Langmuir. 2006 Sep 12;22(19):8104-8. doi: 10.1021/la0605236.
Peptide adhesion on semiconductor surfaces is quantitatively investigated by atomic force microscopy. The selected peptides are shown to cluster at the surface, with the larger, higher, and softer clusters appearing on the surfaces with lower peptide adhesion. Average cluster diameters vary from 40 nm on GaAs (100) to 300 nm on Si (100). Direct adhesion of the peptides to the surface competes with forming molecular aggregates that offer an overall reduced surface contact.
通过原子力显微镜对肽在半导体表面的粘附进行了定量研究。所选肽显示在表面聚集，肽粘附性较低的表面上出现更大、更高且更软的聚集体。平均聚集体直径从砷化镓（100）表面的40纳米到硅（100）表面的300纳米不等。肽与表面的直接粘附与形成分子聚集体相互竞争，而分子聚集体会使整体表面接触减少。
