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聚(N-异丙基丙烯酰胺-co-N,N'-胱胺双丙烯酰胺)薄膜在金表面的吸附及热响应行为

Adsorption and thermoresponsive behavior of poly(N-isopropylacrylamide-co-N,N'-cystaminebisacrylamide) thin films on gold.

作者信息

Park Ellane J, Draper Danielle D, Flynn Nolan T

机构信息

Department of Chemistry, Wellesley College, 106 Central Street, Wellesley, MA 02481-8203, USA.

出版信息

Langmuir. 2007 Jun 19;23(13):7083-9. doi: 10.1021/la700624g. Epub 2007 May 24.

DOI:10.1021/la700624g
PMID:17521209
Abstract

We describe the synthesis of thermoresponsive polymers made from N-isopropylacrylamide and varying amounts of a thiol-containing co-monomer, N,N'-cystaminebisacrylamide (P(NIPAm-co-CBAm)). Infrared spectroscopy revealed a backbone similar to that seen with pure PNIPAm. UV-vis spectroscopy showed that P(NIPAm-co-CBAm) undergoes a thermoresponsive phase transition around 32 degrees C in aqueous solution. The presence of the thiol groups enabled the polymer to adsorb onto gold surfaces. Following adsorption onto a gold surface, X-ray photoelectron spectroscopy showed a carbon/gold atomic ratio of 0.93 for a sample without CBAm and a ratio of 1.61 for a P(NIPAm-co-CBAm) sample with 0.20% CBAm. Quartz crystal microbalance (QCM) analysis showed increases in the mass of polymer adsorbed when the CBAm content in the polymer increased. The thermoresponsive behavior of the thin films on gold was investigated with contact angle and dissipative QCM analysis. Contact angles were measured for polymer films at both 25 and 60 degrees C. The largest temperature-induced alteration in the contact angle was seen with the 1.00% CBAm sample. Similarly, QCM-D results showed a significantly greater change in frequency and dissipation following a temperature change when CBAm was present than in pure NIPAm polymers.

摘要

我们描述了由N-异丙基丙烯酰胺和不同量的含硫醇共聚单体N,N'-胱胺双丙烯酰胺(P(NIPAm-co-CBAm))制成的热响应性聚合物的合成。红外光谱显示其主链与纯PNIPAm的主链相似。紫外-可见光谱表明,P(NIPAm-co-CBAm)在水溶液中于32摄氏度左右经历热响应性相变。硫醇基团的存在使聚合物能够吸附在金表面。吸附到金表面后,X射线光电子能谱显示,不含CBAm的样品的碳/金原子比为0.93,含0.20% CBAm的P(NIPAm-co-CBAm)样品的碳/金原子比为1.61。石英晶体微天平(QCM)分析表明,聚合物中CBAm含量增加时,吸附的聚合物质量增加。通过接触角和耗散QCM分析研究了金表面薄膜的热响应行为。测量了聚合物薄膜在25摄氏度和60摄氏度时的接触角。含1.00% CBAm的样品的接触角随温度变化的幅度最大。同样,QCM-D结果表明,存在CBAm时,温度变化后频率和耗散的变化比纯NIPAm聚合物显著更大。

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