Paredes J I, Martínez-Alonso A, Tascón J M D
Instituto Nacional del Carbón, CSIC, Apartado 73, 33080 Oviedo, Spain.
Langmuir. 2007 Aug 14;23(17):8932-43. doi: 10.1021/la700780k. Epub 2007 Jul 12.
The plasma oxidation process of highly oriented pyrolytic graphite (HOPG) has been investigated through a combination of multiscale (micrometric to atomic) imaging by atomic force and scanning tunneling microscopies (AFM/STM) and STM tip-scratching of the HOPG substrate. Complementary information was obtained by Raman spectroscopy and X-ray photoelectron spectroscopy (XPS). Repetitive imaging of the same HOPG location following a series of consecutive plasma treatments allowed an accurate determination of the plasma etch rates along both the a and c crystallographic directions of the graphite lattice. The etch rates were typically in the range of a few nm per min along the a axis, and the equivalent of 1-6 graphene layers per min along the c axis. The results pointed to the existence of two main plasma etching regimes, related to short (<20-30 min) and long (> or =30 min) treatment times. This was inferred not only from the measured plasma etch rates but also from the observation of fundamental differences in the atomic-scale surface structure of the plasma-treated HOPG samples, and from the general mechanical behavior of the materials under the action of the AFM tip. In particular, atomic-scale STM imaging suggested a change from a defected, but essentially graphitic, surface in the first regime to an amorphous carbon surface in the second regime. Together with AFM and STM, Raman spectroscopy and XPS provided a consistent picture of the surface structure and chemistry of the plasma-modified HOPG in the two regimes. The implications of these results as well as the possible mechanism that drives the plasma etching process in the two regimes are discussed.
通过原子力显微镜和扫描隧道显微镜(AFM/STM)进行多尺度(从微米级到原子级)成像以及对高度取向热解石墨(HOPG)衬底进行STM针尖划痕相结合的方法,对HOPG的等离子体氧化过程进行了研究。通过拉曼光谱和X射线光电子能谱(XPS)获得了补充信息。在一系列连续的等离子体处理后,对同一HOPG位置进行重复成像,从而能够准确测定沿石墨晶格的a和c晶向的等离子体蚀刻速率。蚀刻速率通常沿a轴为每分钟几纳米,沿c轴相当于每分钟蚀刻1 - 6个石墨烯层。结果表明存在两种主要的等离子体蚀刻模式,分别与短(<20 - 30分钟)和长(>或 = 30分钟)处理时间有关。这不仅是从测量的等离子体蚀刻速率推断出来的,还源于对经等离子体处理的HOPG样品原子尺度表面结构的根本差异的观察,以及从材料在AFM针尖作用下的一般力学行为推断出来的。特别是,原子尺度的STM成像表明,在第一种模式下从有缺陷但本质上是石墨的表面转变为第二种模式下的非晶碳表面。拉曼光谱和XPS与AFM和STM一起,提供了两种模式下等离子体改性HOPG表面结构和化学性质的一致图景。讨论了这些结果的意义以及在两种模式下驱动等离子体蚀刻过程的可能机制。