Lee Seong-Hee, Lee Chung-Hyo, Yoon Suk-Ja, Han Seung-Zeon, Lim Cha-Yong
Department of Advanced Materials Science and Engineering, Mokpo National University, Muan-gun 534-729, Chonnam, Korea.
J Nanosci Nanotechnol. 2007 Nov;7(11):3872-5. doi: 10.1166/jnn.2007.050.
Annealing characteristics of a nanostructured copper alloy processed by accumulative roll-bonding (ARB) were studied. A nano-grained Cu-Fe-P alloy processed by 8 cycles of the ARB was annealed at various temperatures ranging from 100 to 400 degrees C for 0.6 ks. The sample still showed an ultrafine grained (UFG) structure up to 250 degrees C, however above 300 degrees C it began to replace by equiaxed and coarse grains due to an occurrence of the conventional static recrystallization. The hardness of the annealed copper decreased largely above 300 degrees C. These annealing characteristics of the UFG copper alloy were compared to those of a high purity copper.
研究了通过累积轧制复合(ARB)工艺制备的纳米结构铜合金的退火特性。对经过8次ARB循环处理的纳米晶Cu-Fe-P合金在100至400摄氏度的不同温度下退火0.6千秒。该样品在高达250摄氏度时仍显示出超细晶粒(UFG)结构,然而在300摄氏度以上,由于传统静态再结晶的发生,它开始被等轴粗晶粒取代。退火铜的硬度在300摄氏度以上大幅下降。将这种UFG铜合金的退火特性与高纯度铜的退火特性进行了比较。