Zhang Hai-Bo, Li Dao-Yu, Li Wei-Qin
Key Laboratory for Physical Electronics and Devices of the Ministry of Education, Department of Electronic Science and Technology, Xi'an Jiaotong University, Xi'an 710049, People's Republic of China.
Rev Sci Instrum. 2007 Dec;78(12):126105. doi: 10.1063/1.2823738.
We clarify the transient process and its mechanism of scanning electron microscope (SEM) images of a trench microstructure buried in insulators. First, interface charges of primary electrons trapped on the trench are derived from the charging model of a capacitor considering the electron beam induced current, and the surface potential is therefore assumed. The SEM signal current is then determined from its simplified relation with the surface potential. Calculated profiles of the secondary electron (SE) signal current and their time-evolution behaviors can well fit the transient of the experimental SEM images. Results show that the variation of the surface potential due to the transient interface charges and the effect of SE redistribution result in transients of the SEM imaging signal and the image width of the buried trench.
我们阐明了埋于绝缘体中的沟槽微结构的扫描电子显微镜(SEM)图像的瞬态过程及其机制。首先,根据考虑电子束感应电流的电容器充电模型推导了捕获在沟槽上的一次电子的界面电荷,进而假设了表面电势。然后根据其与表面电势的简化关系确定SEM信号电流。计算得到的二次电子(SE)信号电流分布及其时间演化行为能够很好地拟合实验SEM图像的瞬态过程。结果表明,瞬态界面电荷引起的表面电势变化以及SE再分布的影响导致了SEM成像信号的瞬态变化和埋入沟槽的图像宽度变化。