Grewe M G, Gururaja T R, Shrout T R, Newnham R E
Hewlett-Packard, Andover, MA.
IEEE Trans Ultrason Ferroelectr Freq Control. 1990;37(6):506-14. doi: 10.1109/58.63106.
The acoustic impedance and attenuation in composites made of particle fillers loaded in polymer matrices for transducer backing applications is investigated. The acoustic impedance of tungsten/vinyl composites was modeled, and an experimental matrix identifying variables that contribute to composite attenuation was established. The variable included the particle type, the particle size and volume fraction of a filler, the physical characteristics of the polymer matrix, and the processing route that determined the composite connectivity. Experimental results showed that with an increase in filler particle size or a decrease in volume fraction of filler, there is an increase in composite attenuation. Overall, the various types of filler, the polymer matrix, and the interface between the two contribute to attenuation in the composite, as confirmed by the acoustic properties and the microstructural analysis.
研究了用于换能器背衬应用的、由聚合物基体中填充颗粒制成的复合材料的声阻抗和衰减。对钨/乙烯基复合材料的声阻抗进行了建模,并建立了一个实验矩阵,以确定导致复合材料衰减的变量。这些变量包括颗粒类型、填料的粒径和体积分数、聚合物基体的物理特性以及决定复合材料连通性的加工路线。实验结果表明,随着填料粒径的增加或填料体积分数的降低,复合材料的衰减增加。总体而言,如声学性能和微观结构分析所证实的,各种类型的填料、聚合物基体以及两者之间的界面都会导致复合材料的衰减。