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具有高连续输出功率和纳秒级输出功率的独立寻址倒装芯片式氮化铝铟镓微像素发光二极管阵列

Individually-addressable flip-chip AlInGaN micropixelated light emitting diode arrays with high continuous and nanosecond output power.

作者信息

Zhang H X, Massoubre D, McKendry J, Gong Z, Guilhabert B, Griffin C, Gu E, Jessop P E, Girkin J M, Dawson M D

机构信息

Institute of Photonics, University of Strathclyde, Wolfson Centre, 106 Rottenrow, Glasgow G40NW, UK.

出版信息

Opt Express. 2008 Jun 23;16(13):9918-26. doi: 10.1364/oe.16.009918.

Abstract

Micropixelated blue (470 nm) and ultraviolet (370 nm) AlInGaN light emitting diode ('micro-LED') arrays have been fabricated in flip-chip format with different pixel diameters (72 microm and 30 microm at, respectively, 100 and 278 pixels/mm(2)). Each micro-LED pixel can be individually-addressed and the devices possess a specially designed n-common contact incorporated to ensure uniform current injection and consequently uniform light emission across the array. The flip-chip micro-LEDs show, per pixel, high continuous output intensity of up to 0.55 microW/microm(2) (55 W/cm(2)) at an injection current density of 10 kA/cm(2) and can sustain continuous injection current densities of up to 12 kA/cm(2) before breakdown. We also demonstrate that nanosecond pulsed output operation of these devices with per pixel onaxis average peak intensity up to 2.9 microW/microm(2) (corresponding to energy of 45pJ per 22ns optical pulse) can be achieved. We investigate the pertinent performance characteristics of these arrays for micro-projection applications, including the prospect of integrated optical pumping of organic semiconductor lasers.

摘要

已采用倒装芯片形式制造了微像素化蓝色(470纳米)和紫外线(370纳米)的铝铟镓氮发光二极管(“微发光二极管”)阵列,其像素直径不同(分别为72微米和30微米,像素密度分别为100和278像素/毫米²)。每个微发光二极管像素都可以单独寻址,并且这些器件具有专门设计的n公共触点,以确保均匀的电流注入,从而使整个阵列实现均匀发光。倒装芯片微发光二极管在10 kA/cm²的注入电流密度下,每个像素的连续输出强度高达0.55微瓦/微米²(55瓦/厘米²),并且在击穿前能够承受高达12 kA/cm²的连续注入电流密度。我们还证明,这些器件可以实现纳秒脉冲输出操作,每个像素的轴上平均峰值强度高达2.9微瓦/微米²(对应于每22纳秒光脉冲45皮焦的能量)。我们研究了这些阵列在微投影应用中的相关性能特性,包括有机半导体激光器集成光泵浦的前景。

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