Zhang H X, Massoubre D, McKendry J, Gong Z, Guilhabert B, Griffin C, Gu E, Jessop P E, Girkin J M, Dawson M D
Institute of Photonics, University of Strathclyde, Wolfson Centre, 106 Rottenrow, Glasgow G40NW, UK.
Opt Express. 2008 Jun 23;16(13):9918-26. doi: 10.1364/oe.16.009918.
Micropixelated blue (470 nm) and ultraviolet (370 nm) AlInGaN light emitting diode ('micro-LED') arrays have been fabricated in flip-chip format with different pixel diameters (72 microm and 30 microm at, respectively, 100 and 278 pixels/mm(2)). Each micro-LED pixel can be individually-addressed and the devices possess a specially designed n-common contact incorporated to ensure uniform current injection and consequently uniform light emission across the array. The flip-chip micro-LEDs show, per pixel, high continuous output intensity of up to 0.55 microW/microm(2) (55 W/cm(2)) at an injection current density of 10 kA/cm(2) and can sustain continuous injection current densities of up to 12 kA/cm(2) before breakdown. We also demonstrate that nanosecond pulsed output operation of these devices with per pixel onaxis average peak intensity up to 2.9 microW/microm(2) (corresponding to energy of 45pJ per 22ns optical pulse) can be achieved. We investigate the pertinent performance characteristics of these arrays for micro-projection applications, including the prospect of integrated optical pumping of organic semiconductor lasers.
已采用倒装芯片形式制造了微像素化蓝色(470纳米)和紫外线(370纳米)的铝铟镓氮发光二极管(“微发光二极管”)阵列,其像素直径不同(分别为72微米和30微米,像素密度分别为100和278像素/毫米²)。每个微发光二极管像素都可以单独寻址,并且这些器件具有专门设计的n公共触点,以确保均匀的电流注入,从而使整个阵列实现均匀发光。倒装芯片微发光二极管在10 kA/cm²的注入电流密度下,每个像素的连续输出强度高达0.55微瓦/微米²(55瓦/厘米²),并且在击穿前能够承受高达12 kA/cm²的连续注入电流密度。我们还证明,这些器件可以实现纳秒脉冲输出操作,每个像素的轴上平均峰值强度高达2.9微瓦/微米²(对应于每22纳秒光脉冲45皮焦的能量)。我们研究了这些阵列在微投影应用中的相关性能特性,包括有机半导体激光器集成光泵浦的前景。