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离子配体介导的金纳米颗粒组装体的电化学充电

Ionic ligand mediated electrochemical charging of gold nanoparticle assemblies.

作者信息

Boettcher Shannon W, Berg Sebastian A, Schierhorn Martin, Strandwitz Nicholas C, Lonergan Mark C, Stucky Galen D

机构信息

Department of Chemistry and Biochemistry and Materials Department, University of California, Santa Barbara, California 93106, USA.

出版信息

Nano Lett. 2008 Oct;8(10):3404-8. doi: 10.1021/nl8021412. Epub 2008 Aug 30.

Abstract

We demonstrate that ionic surface functionalization is well-suited for controlling the electrochemical charging of nanoparticle assemblies. Gold nanoparticles approximately 2 nm in diameter were functionalized with between 0 and approximately 3.3 cationic thiols per particle and the coupled motion of ions and electrons during redox cycling (charging) was followed in situ using an electrochemical quartz-crystal microbalance. When the electrochemistry is performed using a polycation electrolyte too large to penetrate the nanoparticle film, the degree of reduction possible was found to be dictated by the number of cationic ligands on the particle surface available for charge compensation. This route to reduced particles might be useful for electronic device fabrication, since the negative electronic charge is precisely compensated by immobile cationic ligands.

摘要

我们证明,离子表面功能化非常适合用于控制纳米颗粒组件的电化学充电。直径约为2纳米的金纳米颗粒每个颗粒用0至约3.3个阳离子硫醇进行功能化,并且在氧化还原循环(充电)过程中离子和电子的耦合运动通过电化学石英晶体微天平进行原位跟踪。当使用太大而无法穿透纳米颗粒膜的聚阳离子电解质进行电化学时,发现可能的还原程度由颗粒表面上可用于电荷补偿的阳离子配体数量决定。这种制备还原颗粒的方法可能对电子器件制造有用,因为负电荷由固定的阳离子配体精确补偿。

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