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[半径屏障套管对复合树脂固化深度的影响]

[Effect of Radii barrier sleeves on cure depth of composite resin].

作者信息

Wang Binping, DU Yongxiu

机构信息

Stomatology Center,Affiliated Haikou Hospital of Xiangya School of Medicine, Central South University, Haikou 570208, China.

出版信息

Zhong Nan Da Xue Xue Bao Yi Xue Ban. 2009 Jan;34(1):90-2.

PMID:19197136
Abstract

OBJECTIVE

To explore the effect of Radii barrier sleeves on the cure depth of composite resin.

METHODS

Cylinder mold was prepared, and the resin was filled strictly into the mold. The surface was flattened and then cured with plastic engraver's knife.The depth of composite resin which was cured by QHL75TM with or without Radii barrier sleeves was compared.

RESULTS

The cure depth of composite resin which were cured by QHL75TM with or without Radii barrier sleeves of photo-curing machine was 4.38 mm and 4.27 mm respectively,with no statistical difference.

CONCLUSION

The cure depth of composite resin is not influenced by Radii barrier sleeves under the same light condition.

摘要

目的

探讨Radii阻隔套对复合树脂固化深度的影响。

方法

制备圆柱模具,将树脂严格填充到模具中。将表面弄平,然后用塑料雕刻刀固化。比较有或无Radii阻隔套的QHL75TM光固化机固化复合树脂的深度。

结果

有或无Radii阻隔套的QHL75TM光固化机固化复合树脂的深度分别为4.38毫米和4.27毫米,无统计学差异。

结论

在相同光照条件下,Radii阻隔套不影响复合树脂的固化深度。

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