Bliznakov S, Liu Y, Dimitrov N, Garnica J, Sedev R
Department of Chemistry, State University of New York at Binghamton, P.O. Box 6000, Binghamton, New York 13902-6000, USA.
Langmuir. 2009 Apr 21;25(8):4760-6. doi: 10.1021/la803932k.
A simple, inexpensive route for the fabrication of a superhydrophobic metal surface is described. Carbon-carbon composite paper (Toray TGP-H) is electroplated with copper. The copper layer is made hydrophobic by self-assembling a monolayer of dodecanethiol. The surface topography required to induce superhydrophobic behavior is achieved by varying the plating bath composition (Cl-, PEG, and SPS additives) and the time of deposition (effective thickness of the Cu layer). The surface morphology created by the original arrangement of the carbon fibers in the Toray paper (diameter 8 microm, spacing 30 microm) does not produce superhydrophobic behavior. This is true for both continuous and incomplete copper coatings. Truly superhydrophobic behavior (large contact angles, 160-165 degrees, and very small contact angle hysteresis, 2 to 3 degrees) is achieved when a continuous copper layer is deposited on the carbon fibers and also a second micrometer-range roughness is developed as a result of the formation of small copper crystallites (size approximately 1 microm).
本文描述了一种制备超疏水金属表面的简单、低成本方法。将聚丙烯腈基碳纤维纸（东丽TGP-H）进行铜电镀。通过自组装一层十二烷基硫醇使铜层具有疏水性。通过改变镀液成分（Cl-、PEG和SPS添加剂）和沉积时间（铜层的有效厚度）来实现诱导超疏水行为所需的表面形貌。东丽纸中碳纤维的原始排列（直径8微米，间距30微米）所产生的表面形态不会产生超疏水行为。连续和不完全的铜涂层都是如此。当在碳纤维上沉积连续的铜层，并且由于形成小的铜微晶（尺寸约为1微米）而产生第二个微米级粗糙度时，可实现真正的超疏水行为（大接触角，160 - 165度，以及非常小的接触角滞后，2至3度）。
