Suppr超能文献

通过热分析对1-甲基环丙烯与α-环糊精包合物热刺激解离的动力学研究

Kinetic study of thermally stimulated dissociation of inclusion complex of 1-methylcyclopropene with alpha-cyclodextrin by thermal analysis.

作者信息

Neoh Tze Loon, Yamauchi Kousuke, Yoshii Hidefumi, Furuta Takeshi

机构信息

Department of Biotechnology, Tottori University, 4-101 Koyamacho-minami, Tottori 680-8552, Japan.

出版信息

J Phys Chem B. 2008 Dec 11;112(49):15914-20. doi: 10.1021/jp806233c.

Abstract

The thermally stimulated dissociation of the inclusion complex of 1-methylcyclopropene (1-MCP) with alpha-cyclodextrin (alpha-CD) in solid state was studied by means of thermogravimetry (TG) and differential scanning calorimetry (DSC). The mass loss of 1-MCP/alpha-CD inclusion complex occurs in four separated phases with the thermal dissociation of the inclusion complex and release of 1-MCP taking place in the second phase between 90 and 230 degrees C. The kinetic parameters of the dissociation reaction (the apparent activation energy of dissociation, E(D), the reaction order of thermal dissociation, n, and the pre-exponential factor, k0) were evaluated. The dissociation reaction was satisfactorily described by the unimolecular decay law, where the reaction order, n = 1. The effect of the molar ratio of 1-MCP to alpha-CD (inclusion ratio) in the inclusion complex on the temperature dependence of the dissociation reaction was also studied. The E(D) decreased with increasing inclusion ratio indicating higher complex stability at lower inclusion ratios. The extrapolation of the E(D) of the inclusion complexes with different inclusion ratios to 1 mol 1-MCP/mol alpha-CD yielded the "true" E(D) of 20.9 +/- 2.8 and 18.1 +/- 0.2 kJ/mol for TG and DSC, respectively. The "true" ln k(0TG) and the "true" ln k(0DSC) were also determined by extrapolation, yielding values of +4.5 +/- 1.0 and -0.3 +/- 0.3, respectively.

摘要

采用热重分析法(TG)和差示扫描量热法(DSC)研究了固态下1-甲基环丙烯(1-MCP)与α-环糊精(α-CD)包合物的热刺激解离。1-MCP/α-CD包合物的质量损失分四个阶段发生,包合物的热解离和1-MCP的释放发生在第二阶段,温度范围为90至230℃。评估了解离反应的动力学参数(解离的表观活化能E(D)、热解离的反应级数n和指前因子k0)。解离反应可用单分子衰减定律很好地描述,其中反应级数n = 1。还研究了包合物中1-MCP与α-CD的摩尔比(包合比)对解离反应温度依赖性的影响。E(D)随包合比的增加而降低,表明在较低包合比下包合物稳定性更高。将不同包合比的包合物的E(D)外推至1 mol 1-MCP/mol α-CD时,TG和DSC得到的“真实”E(D)分别为20.9±2.8和18.1±0.2 kJ/mol。“真实”的ln k(0TG)和“真实”的ln k(0DSC)也通过外推法确定,分别得到+4.5±1.0和 -0.3±0.3的值。

文献检索

告别复杂PubMed语法,用中文像聊天一样搜索,搜遍4000万医学文献。AI智能推荐,让科研检索更轻松。

立即免费搜索

文件翻译

保留排版,准确专业,支持PDF/Word/PPT等文件格式,支持 12+语言互译。

免费翻译文档

深度研究

AI帮你快速写综述,25分钟生成高质量综述,智能提取关键信息,辅助科研写作。

立即免费体验