Xu Lin, Shi Tongfei, An Lijia
State Key Laboratory of Polymer Physics and Chemistry, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, Changchun 130022, People's Republic of China.
J Chem Phys. 2009 May 14;130(18):184903. doi: 10.1063/1.3132785.
We investigate the dewetting behavior of the bilayer of air/PS/PMMA/silanized Si wafer and find the two competing dewetting pathways in the dewetting process. The upper layer dewets on the lower layer (dewetting pathway 1, the liquid-liquid dewetting) and the two layers rupture on the solid substrate (dewetting pathway 2, the liquid-solid dewetting). To the two competing dewetting pathways, the process of forming holes and the process of hole growth, influence their competing relation. In the process of forming holes, the time of forming holes is a main factor that influences their competing relation. During the process of hole growth, the dewetting velocity is a main factor that influences their competing relation. The liquid-liquid interfacial tension, the film thickness of the polymer, and the viscosity of the polymer are important factors that influence the time of forming holes and the dewetting velocity. When the liquid-liquid dewetting pathway and the liquid-solid dewetting pathway compete in the dewetting process, the competing relation can be controlled by changing the molecular weight of the polymer, the film thickness, and the annealing temperature. In addition, it is also found that the rim growth on the solid substrate is by a rolling mechanism in the process of hole growth.
我们研究了空气/聚苯乙烯（PS）/聚甲基丙烯酸甲酯（PMMA）/硅烷化硅片双层体系的去湿行为，并在去湿过程中发现了两种相互竞争的去湿途径。上层在下层上发生去湿（去湿途径1，液-液去湿），并且两层在固体衬底上破裂（去湿途径2，液-固去湿）。对于这两种相互竞争的去湿途径，形成孔洞的过程和孔洞生长的过程会影响它们的竞争关系。在形成孔洞的过程中，形成孔洞的时间是影响它们竞争关系的主要因素。在孔洞生长过程中，去湿速度是影响它们竞争关系的主要因素。液-液界面张力、聚合物的膜厚以及聚合物的粘度是影响形成孔洞的时间和去湿速度的重要因素。当液-液去湿途径和液-固去湿途径在去湿过程中相互竞争时，可以通过改变聚合物的分子量、膜厚和退火温度来控制竞争关系。此外，还发现在孔洞生长过程中，固体衬底上的边缘生长是通过滚动机制进行的。
