Cha Nam-Goo, Echegoyen Yolanda, Kim Tae-Hoon, Park Jin-Goo, Busnaina Ahmed A
NSF Nanoscale Science and Engineering Center for High-Rate Nanomanufacturing, Northeastern University, Boston, Massachusetts 02115, USA.
Langmuir. 2009 Oct 6;25(19):11375-82. doi: 10.1021/la901496s.
A convective directed-assembly process on a flat substrate that does not require motion and is followed by a dry-transfer process of nanoparticles is presented. The convective assembly process was achieved using Au nanoparticles on hydrophobic/hydrophilic-surface-patterned Si substrates as functions of temperature, gap height, and particle size. An investigation of the particle assembly mechanism showed that the effects of temperature, gap height, and particle size were responsible for controlling the evaporation time, the evaporation length, and the assembly speed, respectively. To ensure conformal contact during the dry-transfer process, chemically patterned hybrid templates with elastic and flexible properties were fabricated and used. The hybrid templates provided conformal contact with a target silicon substrate coated with MPTMS (3-mercaptopropyltrimethoxysilane) and successfully transferred Au particles to the target substrates.
本文介绍了一种在平面基板上的对流定向组装工艺,该工艺无需移动,随后是纳米颗粒的干转移工艺。利用疏水性/亲水性表面图案化的硅基板上的金纳米颗粒,根据温度、间隙高度和颗粒尺寸实现了对流组装工艺。对颗粒组装机制的研究表明,温度、间隙高度和颗粒尺寸的影响分别负责控制蒸发时间、蒸发长度和组装速度。为了在干转移过程中确保共形接触,制备并使用了具有弹性和柔性特性的化学图案化混合模板。该混合模板与涂有MPTMS(3-巯基丙基三甲氧基硅烷)的目标硅基板提供了共形接触,并成功地将金颗粒转移到目标基板上。