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通过使用介质-金属多层结构的表面等离子体干涉光刻技术将特征尺寸缩小至22纳米以下。

Breaking the feature sizes down to sub-22 nm by plasmonic interference lithography using dielectric-metal multilayer.

作者信息

Yang Xuefeng, Zeng Beibei, Wang Changtao, Luo Xiangang

机构信息

State Key Laboratory of Optical Technologies for Microfabrication, Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu, China.

出版信息

Opt Express. 2009 Nov 23;17(24):21560-5. doi: 10.1364/OE.17.021560.

Abstract

We have developed the plasmonic interference lithography technique to achieve the feature sizes theoretically down to sub-22 nm even to 16.5 nm by using dielectric-metal multilayer (DMM) with diffraction-limited masks at the wavelength of 193 nm with p-polarization. An 8 pairs of GaN (10 nm)/Al (12 nm) multilayer is designed as a filter allowing only a part of high wavevector k (evanescent waves) to pass through for interference lithography. The analysis of the influence by the number of DMM layers is presented. 4 pairs of the proposed multilayer can be competent for pattern the minimal feature size down to 21.5 nm at the visibility about 0.4 to satisfy the minimum visibility required with positive resist. Finite-difference time-domain analysis method is used to demonstrate the validity of the theory.

摘要

我们已经开发出了表面等离子体干涉光刻技术,通过使用介电-金属多层膜(DMM)和衍射极限掩膜,在193nm波长的p偏振光下,理论上可实现低至22nm甚至16.5nm的特征尺寸。设计了8对GaN(10nm)/Al(12nm)多层膜作为滤波器,仅允许一部分高波矢k(倏逝波)通过以进行干涉光刻。文中给出了对DMM层数影响的分析。4对所提出的多层膜能够胜任在约0.4的可见度下对低至21.5nm的最小特征尺寸进行图案化,以满足正性光刻胶所需的最小可见度。采用时域有限差分分析方法来证明该理论的有效性。

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