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由粉碎的废弃印刷电路板的非金属制成的木塑复合材料。

Wood plastic composite produced by nonmetals from pulverized waste printed circuit boards.

机构信息

School of Environmental Science and Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240, People's Republic of China.

出版信息

Environ Sci Technol. 2010 Jan 1;44(1):463-8. doi: 10.1021/es902889b.

Abstract

Nonmetals reclaimed from waste printed circuit boards (PCBs) are used to replace wood flour in the production of wood plastic composite (WPC). To evaluate property durability against weather exposure, the effects of accelerated aging process on the properties of WPC are investigated. The results show that filling of nonmetals in WPC improves the flexural strength and tensile strength, and reduces screw withdrawal strength. Before hollow WPC with 15% nonmetals (H-15-WPC) underwent aging process, H-15-WPC had a flexural strength of 25.8 MPa, a tensile strength of 9.8 MPa, a charpy impact strength of 3.4 kJ/m(2), and face/edge screw withdrawal strength of 121/115 N/mm. It is found that flexural strength of H-15-WPC decreases linearly with the increase of accelerated aging cycles, and the effects of aging test on tensile and impact strength of H-15-WPC are minor. For solid WPC, the accelerated aging test decreases screw withdrawal strength slightly. All the results indicate that nonmetals of waste PCBs can be reused as an alternative for wood flour in WPC products rather than resorting to their landfill or combustion.

摘要

从废弃印刷电路板 (PCB) 中回收的非金属材料被用于替代木塑复合材料 (WPC) 生产中的木粉。为了评估耐候性能,研究了加速老化过程对 WPC 性能的影响。结果表明,WPC 中非金属材料的填充提高了弯曲强度和拉伸强度,降低了螺钉拔出强度。在 15%的空心 WPC(H-15-WPC)进行老化处理之前,H-15-WPC 的弯曲强度为 25.8 MPa,拉伸强度为 9.8 MPa,夏比冲击强度为 3.4 kJ/m(2),面/边螺钉拔出强度为 121/115 N/mm。发现 H-15-WPC 的弯曲强度随加速老化循环次数的增加呈线性下降,而老化试验对 H-15-WPC 的拉伸和冲击强度影响较小。对于实心 WPC,加速老化试验略微降低了螺钉拔出强度。所有结果表明,废弃 PCB 中的非金属材料可以作为 WPC 产品中木粉的替代品重复使用,而不是将其填埋或燃烧。

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