Consiglio Nazionale delle Ricerche, Istituto di Acustica O.M. Corbino, Rome, Italy.
IEEE Trans Ultrason Ferroelectr Freq Control. 2010 May;57(5):1175-82. doi: 10.1109/TUFFC.2010.1530.
An electroacoustic micro-device based on the propagation of guided acoustic Lamb waves in AlN/Al plate is described. The AlN thin film is deposited by sputtering technique, optimized to achieve a high degree of orientation (rocking curve full-width at half-maximum /sp lap/ 3.5 degrees ) of the c-axis perpendicular to the plate surface. The AlN plate is micromachined using anisotropic reactive ion etching (RIE), followed by isotropic RIE to remove the silicon underlayer. Simulation results for the dispersion phase velocity curves and the electromechanical coupling coefficient (K(2)) are obtained by the matrix method and by the finite element method and compared with experimental data. A delay line is implemented on the structure and tested for the propagation of the first symmetrical Lamb mode (s(0)) at the frequency of 1.22 GHz. Measurements have shown that the structure is suitable for implementation of arrays of electroacoustic devices on a single chip for application to both sensing devices and signal processing systems.
本文描述了一种基于在 AlN/Al 板中导声 Lamb 波传播的电声微器件。通过溅射技术沉积 AlN 薄膜,并对其进行优化,使其 c 轴高度取向(摇摆曲线半最大值全宽/rocking curve full-width at half-maximum /sp lap/ 3.5 度)垂直于板面。使用各向异性反应离子刻蚀(RIE)对 AlN 板进行微加工,然后进行各向同性 RIE 以去除硅底层。通过矩阵法和有限元法获得了色散相速度曲线和机电耦合系数(K(2))的模拟结果,并与实验数据进行了比较。在结构上实现了延迟线,并在 1.22GHz 的频率下测试了第一个对称 Lamb 模式(s(0))的传播。测量结果表明,该结构适用于在单个芯片上实现电声器件阵列,可应用于传感器件和信号处理系统。