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新型无填料实验性自酸蚀底漆黏结剂与传统填料黏结剂的托槽黏结强度比较。

Bracket bond strength comparison between new unfilled experimental self-etching primer adhesive and conventional filled adhesives.

机构信息

Department of Oral Growth and Development, Health Sciences University of Hokkaido, Hokkaido, Japan.

出版信息

Angle Orthod. 2010 Nov;80(6):1095-9. doi: 10.2319/012010-43.1.

DOI:10.2319/012010-43.1
PMID:20677960
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8929506/
Abstract

OBJECTIVE

To determine if a new unfilled experimental self-etching primer (SEP) adhesive system (SBP-40TX + C&B Metabond) that incorporates a methyl methacrylate-based 4-META/TBB (4-methacryloxyethyl trimellitate anhydride tri-n-butyl borane) resin can provide adequate shear bond strength (SBS) when used for bonding orthodontic brackets.

METHODS AND MATERIALS

Forty-eight human maxillary premolars were randomly divided into three groups of 16 specimens each. Brackets were bonded with three bonding systems. A filled Bis-GMA/TEGDM (triethylene glycol dimethacrylate)-based SEP adhesive system (Transbond Plus) and an unfilled conventional etch-and-rinse adhesive system (C&B Metabond) were used for comparison. The SBS for each sample was examined with a universal testing machine, and the Adhesive Remnant Index score was calculated. Enamel surfaces after conditioning were examined using a scanning electron microscope. Data were compared by one-way analysis of variance and a chi(2) test.

RESULTS

The experimental SEP showed a milder etching pattern than Transbond Plus SEP. No statistically significant differences in the mean SBS were found between the specimens bonded with the unfilled experimental SEP adhesive system (10.0 MPa) and the filled SEP adhesive system (8.7 MPa). The unfilled experimental SEP adhesive system showed less residual adhesive than the filled SEP adhesive system.

CONCLUSIONS

The unfilled experimental SEP adhesive system showed a clinically sufficient SBS that was equivalent to the filled SEP adhesive system.

摘要

目的

确定一种新型未填充实验性自酸蚀底漆（SEP）粘结剂系统（SBP-40TX+C&B Metabond）是否能为正畸托槽提供足够的剪切粘结强度（SBS），该系统包含甲基丙烯酸甲酯基 4-META/TBB（4-甲基丙烯酰氧基乙基偏苯三酸酐三丁基硼）树脂。

方法与材料

48 颗上颌前磨牙随机分为 3 组，每组 16 颗。用三种粘结系统粘结托槽。使用一种填充 Bis-GMA/TEGDM（三乙二醇二甲基丙烯酸酯）基 SEP 粘结剂系统（Transbond Plus）和一种未填充常规酸蚀-冲洗粘结剂系统（C&B Metabond）进行对比。用万能试验机检测每个样本的 SBS，计算粘结残留指数评分。用扫描电子显微镜观察处理后的牙釉质表面。采用单因素方差分析和卡方检验进行数据比较。

结果

实验性 SEP 显示出比 Transbond Plus SEP 更温和的蚀刻模式。未填充实验性 SEP 粘结剂系统（10.0MPa）与填充 SEP 粘结剂系统（8.7MPa）的试件之间 SBS 均值无统计学差异。未填充实验性 SEP 粘结剂系统的残留粘结剂少于填充 SEP 粘结剂系统。

结论

未填充实验性 SEP 粘结剂系统的 SBS 达到临床足够水平，与填充 SEP 粘结剂系统相当。

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